Proposed IEC Standard on Halogen-Free Raises Concerns
July 10, 2017 | IPCEstimated reading time: 1 minute
Like the game Whack-a-Mole, the idea of a standard for low-halogen electronics keeps popping up. Originally, proposed as an IPC specification of chlorine and bromine in copper-clad laminates, IEC 61249-2-21 was established many years ago to define FR-4 products for halogen-free.
Then about a decade ago, concerns about certain toxic bromine-containing flame-retardants (polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs) and concerns regarding incomplete combustion of PVC and bromine-containing plastics in electronics led to the passage of the EU WEEE Regulation and RoHS Directive which banned the toxic substances and mandated appropriate handling of waste electronics.
Despite the removal of any toxic halogen-containing compounds from the electronics supply chain, IPC and JEDEC members began discussions about the development of a standard for low halogen electronics. IPC, with its broad membership and open voting processes, never approved the low halogen standard, which was deemed to be a marketing tool posing as an environmental standard. JEDEC, with its narrower membership, went ahead and passed and published "Definition of 'Low Halogen' for Electronic Products” in 2015.
In 2016, the JEDEC standard was temporarily (up to six years) approved by IEC TC 111 (environmental standardization committee) as an IEC publicly available specification (PAS), despite the broad questions that were raised regarding technical validity. Revision and permanent adoption of the standard is now being considered by TC 111. The proposed revision would define electronics as “Low Halogen” when they “contain less than 0,9% (by mass) total elemental halogen content (F+Cl+Br+I) and meet the thresholds of all halogenated substances in IEC 91 62474 database." The proposed standard is concerning not just because of the content of the proposal, but by the labeling of low halogen as an environmental standard.
The standard is in the Committee Draft Phase which means it is being circulated for comments to all IEC TC111 member countries. The deadline for comment is September 15, 2017. If you are concerned, contact your country’s IEC National Committee and the IEC TC111 representatives.
Suggested Items
TTM’s High Tech Expansion and Industry Innovation
04/30/2024 | Marcy LaRont, PCB007 MagazineTom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
04/29/2024 | IPCIPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.