Physicists Develop a Cooling System for the Processors of the Future
April 20, 2016 | ACSEstimated reading time: 3 minutes
Dmitry Fedyanin and Andrey Vyshnevyy, researchers at MIPT’s Laboratory of Nanooptics and Plasmonics, have found a solution to this problem. They have demonstrated that using high-performance thermal interfaces, i.e. layers of thermally conductive materials placed between the chip and the cooling system to ensure efficient heat removal from the chip, (thermal grease is a popular type of thermal interface, although it is not very efficient) high-performance optoelectronic chips can be cooled using conventional cooling systems.
Based on the results of numerical simulations, Fedyanin and Vyshnevyy concluded that if an optoelectronic chip with active plasmonic waveguides is placed in air, its temperature will increase by several hundred degrees Celsius, which will cause the device to malfunction. Multi-layered thermal interfaces of nano- and micrometer thickness combined with simple cooling systems can reduce the temperature of the chip from several hundred degrees to approximately ten degrees with respect to the ambient temperature. This opens the prospects for the implementation of high-performance optoelectronic microprocessors in a wide range of applications, ranging from supercomputers to compact electronic devices.
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