Lumotive Partners with Hokuyo to Revolutionize 3D Lidar Sensing for Industrial Automation
June 1, 2023 | PRNewswireEstimated reading time: 2 minutes
Lumotive, a company specializing in Light Control Metasurface (LCM) beam steering chips for advanced 3D optical sensors, and Hokuyo Automatic Co., Ltd., a worldwide producer of sensor and automation technology, have revealed a multi-year production contract. This partnership will expedite the deployment of essential sensor technology in robotics and autonomous systems applications.
Utilizing Lumotive's advanced truly solid-state beam steering chip, Hokuyo is preparing to produce a revolutionary 3D lidar sensor based on Lumotive's M30 reference design targeted for industrial applications. This trailblazing new product is expected to surpass conventional mechanical lidar and time of flight camera technology, fostering progress in Automated Guided Vehicles (AGV), Autonomous Mobile Robots (AMR), and other industrial applications. In addition, as part of this partnership, Hokuyo is using Lumotive's top-tier manufacturing partners and engineering expertise to bring their advanced sensing products to market faster.
Hokuyo Automatic is a global leader in manufacturing industrial automation sensors, including lidar sensors, which are used for robotics, material handling, and other industrial automation applications. Hokuyo Automatic chose Lumotive's LCM technology for its digital beam-steering capabilities, which enable the company to produce 3D sensing solutions that are more accurate, reliable, and cost-effective than current offerings.
Lumotive's patented technology, based on well-established semiconductor manufacturing technology, delivers the world's first solid-state metasurface beam steering chips ready for mass production. Lumotive's LCM chips enable unprecedented miniaturization, lower costs, and higher reliability compared to existing scanning lidar solutions. These advantages offer significant benefits across a wide range of applications in key industries including consumer electronics, industrial automation, and autonomous vehicles.
Lumotive-enabled solid-state 3D lidar sensors bring revolutionary advantages to real-world industrial automation. The large field of view and extended range in a compact form allows for seamless integration into diverse machinery, from robotics to conveyor systems. Its superior outdoor performance ensures reliable operations, even in expansive outdoor industrial sites or warehouses with challenging lighting conditions. The software-defined scan modes enable customization to specific tasks, such as precise object tracking on production lines or efficient navigation for AMRs. The system's ability to minimize interference and multipath effects results in better point cloud quality, which is crucial for accurate sensing in complex industrial environments.
"We are impressed with Lumotive's LCM optical semiconductor technology and believe that it will be a game-changer for the industrial automation market," said Hokuyo's President, Hitoshi Ozaki. "Lumotive's product delivers a new level of miniaturization, performance and reliability, which will enable us to expand our business with innovative 3D sensing solutions that could not be realized with conventional lidar scanning technology. We look forward to working with Lumotive to bring these solutions to market."
"Securing a design win of this stature is a notable accomplishment, and we are eager to move forward with Hokuyo Automatic in incorporating our LCM technology into our first industrial automation application," said Dr. Sam Heidari, CEO of Lumotive. "Hokuyo Automatic's expertise in industrial automation and sensor technology makes them an ideal partner to accelerate the adoption of our ground-breaking LCM semiconductor technology. This production supply agreement marks an important milestone for Lumotive, as we bring advanced 3D sensing solutions to the robotics and autonomous systems markets."
Suggested Items
Boeing Opens Research & Technology Center in Japan
04/23/2024 | BoeingBoeing today opened a Boeing Research & Technology (BR&T) Center in Japan that will focus on innovation to enable the commercial aviation industry meet its goal of net zero carbon emissions by 2050.
Schweizer Electronic Appoints Thomas Gottwald as New Member of the Executive Board
04/23/2024 | Schweizer Electronic AGThe Supervisory Board of Schweizer Electronic AG has appointed Mr. Thomas Gottwald to the Executive Board as CTO (Chief Technology Officer) for a period of 3 years with effect from 1 May 2024.
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
04/23/2024 | IntelThe U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.
Real Time with... IPC APEX EXPO 2024: Industrial Quality Solutions from Zeiss
04/23/2024 | Real Time with...IPC APEX EXPOEditor Nolan Johnson and Herminso Gomez of Zeiss Group discuss the company's industrial quality solutions, with a focus on X-ray technology. Zeiss provides a range of microscopy options and Herminso highlights the advantages of X-ray technology for aerospace, medical, and consumer electronics sectors.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.