Orbotech Inkjet 600 Selected by Amkor Technology for System-in-Package Applications
July 11, 2016 | OrbotechEstimated reading time: 2 minutes
ORBOTECH LTD. today announced that its Orbotech Inkjet 600 system has been selected by Amkor Technology, Inc., a leading provider of semiconductor packaging and test services. By using Orbotech Inkjet 600 to print high aspect ratio, 3D underfill dams for new system-in-package (SiP) products, Amkor aims to maximize its manufacturing flexibility, increase its feature position accuracy and reduce its design-to-manufacturing lifecycle.
“Amkor’s use of Orbotech Inkjet 600 for 3D printing is a significant implementation of process innovation in high-volume semiconductor packaging,” said Mr. Kevin Crofton, President of SPTS and Corporate Vice President at Orbotech. “We are experiencing a great deal of interest in inkjet printing from the packaging industry, for applications ranging from underfill dams to package marking to the direct printing of isolation layers. We believe that this may be the beginning of an industry trend towards adopting additive manufacturing solutions for seamless production processes. Our Orbotech Inkjet 600 offers device manufacturers unprecedented flexibility in product development, reduced cycle times and lower overall cost of ownership.”
“Amkor's emphasis is on functional integration and size reduction by using different package and interconnect technologies for System-in-Package offerings,” commented JuHoon Yoon, Amkor’s R&D Vice President in Korea. “By investing in solutions such as Orbotech Inkjet 600 for printing of underfill dams as opposed to conventional methods, we enable higher levels of integration in smaller form factors for our customers.”
Underfill dams prevent leakage between active and passive components and are an essential process in SiP packaging for both device and sub-component substrates. With its high-accuracy printing capability, the Orbotech Inkjet 600 enables the formation of tall underfill dams in a single step with real-time local alignment correction for tighter integration of components. This not only leads to a shorter process by replacing existing cumbersome, subtractive processes, but also significantly lowers manufacturing costs.
Orbotech, together with SPTS Technologies, an Orbotech company, will be exhibiting at SEMICON West, Booth No. 1417 (South Hall) from July 12-14 in San Francisco.
About Orbotech Inkjet 600
Orbotech Inkjet 600 provides cost-effective, high quality additive printing solutions for IC packaging production. Based on Orbotech’s advanced DotStream Pro Technology, the Inkjet 600 prints fine lines and uniform thin layers at any angle and on a wide range of materials. Its sophisticated automatic measurements and scaling modes enable market-leading registration and accuracy. The Orbotech Inkjet 600 offers flexible, cost efficient solutions for IC packaging applications, including tall, high-aspect ratio 3D dams (ratio of 1:4), accurate isolation layers, IC units marking and serialization.
About Orbotech Ltd.
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement, and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems (MEMS), LED, high speed RF on GaAs, power management device and other electronic components. Today, virtually every electronic device in the world is produced using Orbotech systems.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Tools, Training, and Trends in Manufacturing Engineering
04/25/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and Product Specialist Erik Bateham of Polar Instruments discuss Polar's latest technology, including their role in aiding manufacturing engineers. They highlight the advanced capabilities of Polar's tools and the critical role of signal integrity analysis, as well as the importance of accurate modeling in board manufacturing. Polar's unique training approach and demonstration contact details are also explored.
TTM Celebrates the Grand Opening of Its First Manufacturing Facility in Penang
04/25/2024 | TTM Technologies, Inc.TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (PCBs), officially opened its first manufacturing plant in Penang, Malaysia with an investment of USD200 million (approximately RM958 million).
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Fujitsu, METRON Collaborate to Drive ESG Success
04/24/2024 | JCN NewswireFujitsu Limited and METRON SAS, a French cleantech company specializing in energy management solutions for industrial decarbonization, today announced a strategic initiative to contribute to the realization of carbon neutrality in the manufacturing industry.