Growth in Wearable Electronics Enabled by Advances in Assembly and Packaging
July 28, 2016 | TechSearch International, Inc.Estimated reading time: 1 minute
Strong market growth is predicted for wearable electronics fueled by new generations of wearables providing greater functionality in the same or smaller form factor, for the same or lower cost. While improvements in IC technologies and software continue to make wearables smarter, advancements in assembly and packaging allow OEMs to meet small form factor, low-power consumption, and low-cost requirements.
One common theme emerging from TechSearch International’s interviews is that, for a wearable to succeed in the marketplace, it must simplify tasks for its user, not complicate them. That requires greater intelligence from both hardware and software. The high degree of functionality in today’s wearables has been made possible by advanced assembly and packaging technologies, use of wafer-level packages (WLPs) in particular.
Health, sports, and fitness monitoring are driving the wearables market. Basic requirements for activity trackers and smartwatches are: user friendly, comfortable, secure; always on and monitoring; ubiquitous connectivity; durability; and low cost for consumers. The trend in fitness bands and smartwatches is a growing number and variety of sensors.
Many different IC and package types are found in wearable electronics. A typical product contains a microcontroller, a power management device, memory, and a connectivity device (i.e., Wi-Fi or Bluetooth). Wearables also contain MEMS sensors such as accelerometers, gyroscopes, pressure sensors, and compasses, and sometimes sensors for monitoring pulse and blood oxygen saturation, ambient light, and temperature. Packages found in these products include FBGAs, FLGAs, QFNs, stacked die CSPs, WLPs, and system-in-package (SiP). Expanding use of fan-out WLP (FO-WLP) is likely to support form factor, high I/O density, and performance requirements.
TechSearch International’s new 34-page Advanced Packaging Update report with full references provides an analysis of trends in wearable electronics and package adoption not only for smartwatches and activity trackers, but also for VR and AR headsets, body cameras, and wireless multi-function earbuds. The report also contains an updated forecast for FO-WLP in packages and reconstituted wafers, based on new plans for package adoption, as well as new battery technology developments. A set of 28 PowerPoint slides accompanies the report.
About TechSearch International, Inc.
TechSearch International, Inc., founded in 1987, is a market research leader specializing in advanced packaging trends. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 17,000 contacts in North America, Asia, and Europe.
Suggested Items
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).
Technica USA Presents Inaugural Supplier Alliance Award at IPC APEX EXPO 2024
04/24/2024 | Technica USADuring IPC APEX EXPO 2024, Technica USA took the opportunity to thank all of their supply partners that made the effort to join them for the exhibition in their booth, as well to all of our SMT partners that had their own booths, with the latest in automation and process technology.
IDTechEx Report Unveils 3D Electronics Status and Opportunities
04/22/2024 | PRNewswire3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.
IDTechEx Examines the Opportunities for Wearables in Digital Health
04/19/2024 | IDTechExIDTechEx’s report, “Digital Health and Artificial Intelligence 2024-2034: Trends, Opportunities, and Outlook”, covers this ongoing trend in the consumer health wearables market and includes analysis of the opportunities and roadmap for biometric monitoring.
Real Time with... IPC APEX EXPO 2024: Pluritec's Expansion and Growth in the North American Market
04/19/2024 | Real Time with...IPC APEX EXPONicola Doria, president of Pluritec, discusses the company's strategic focus on the North American market, their investment in a new sales organization, service expansion, and a new process integration line. The conversation also covers market response and future installations, as well as Pluritec's new partnership with IEC.