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UHDI Fundamentals: ASC Sponsors Ultra High Density Interconnect Symposium 

03/21/2024 | Anaya Vardya, American Standard Circuits
American Standard Circuits (ASC) is a major sponsor of an upcoming symposium on one of the most talked about new technologies that has come along in quite a while: ultra high density interconnect (UHDI).

onsemi Aligns Business Groups to Expand Product Portfolio and Accelerate Growth

03/13/2024 | onsemi
onsemi announced the formation of the Analog and Mixed-Signal Group (AMG) which will be led by newly appointed group president, Sudhir Gopalswamy.

Indium Corporation Experts to Present at SEMI THERM

03/07/2024 | Indium Corporation
Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen and Product Development Specialist for Thermal Interface Materials Miloš Lazić will present on thermal interface material (TIM) technology at SEMI-THERM, taking place March 25–28 in San Jose, California, U.S.

HARMAN Automotive Extends Partnership with Scuderia Ferrari

02/28/2024 | BUSINESS WIRE
HARMAN, an automotive electronics technology company and subsidiary of Samsung Electronics Co., Ltd. focused on delivering consumer experiences at automotive grade, confirms it will continue as an Official partner of Scuderia Ferrari for a second Formula One season. The on-track marketing partnership extends to technology on the road, with Ferrari becoming the first automotive OEM to adopt a number of solutions from HARMAN’s in-cabin monitoring system, HARMAN Ready Care, for its next-generation road cars.

A System Designer’s Dream World at DuPont

02/07/2024 | Marcy LaRont, PCB007 Magazine
DesignCon 2024 was held January 30–February 1 in Silicon Valley, and Design007 Editor Andy Shaughnessy and I were there to experience this important show for PCB and system designers. We are always on the lookout for gems that showcase innovation and cutting-edge technology. Such an opportunity arose through a private tour at DuPont’s Silicon Valley Technology Center in Sunnyvale.
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