Latest News

Qualcomm, Microsoft Align Efforts to Scale On-Device AI at Build
05/26/2023 | Qualcomm Technologies, Inc.
Global Electronic Vehicle Market Almost Reached 11M Units in 2022
05/26/2023 | IDC
EWPTE, the Cable and Wire Harness Industry’s Exclusive Trade Show Draws More than 3,000 Attendees
05/26/2023 | IPC
DRAM Industry Q1 Revenues Decline 21.2% QoQ
05/25/2023 | TrendForce
Ayar Labs Adds $25 Million in Expansion of Its $130 Million Series C
05/25/2023 | Business Wire
Mouser Electronics Named 2022 Distributor of the Year by Bel
05/25/2023 | Business Wire
BrainChip, CVEDIA Team to Advance State-of-the-Art Edge AI and Neuromorphic Computing
05/24/2023 | Business Wire
Intel, Microsoft Collaborate to Advance Artificial Intelligence for Windows 11 PCs
05/24/2023 | Intel
Foldable Smartphone Shipments Expected to Soar by Over 50% YoY, Reaching 19.8 Million Units in 2023
05/24/2023 | TrendForce
Gartner Forecasts Worldwide Government IT Spending to Grow 8% in 2023
05/24/2023 | Gartner, Inc.

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Customer Service Featuring:

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A New Materials Paradigm Featuring:

  • Slash Sheets and Material Selection, a conversation with Doug Sober
  • Select Dielectric Material With Precision, by Barry Olney
  • Stop Over-specifying Your Materials, by Kelly Dack
  • Slash Sheets: Don’t Fall Into the Trap, by Geoffrey Hazelett
  • Batter Up: Stepping Up to the Substrate, by Tim Haag
  • Selecting Flex Materials: Do Your Homework, by Mike Morando
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