FEATURED NEWS AND INFORMATION:

Latest News

Gartner Forecasts Worldwide Semiconductor Revenue Growth to Decline 3.6% in 2023
New Today | Gartner, Inc.
ITRI Announces Collaborates with K&S in Hi-CHIP Alliance
11/29/2022 | ITRI
NB Panel Shipments in October Dropped to a Decade Low for That Month and Will Remain in a Slump in 4Q22
11/29/2022 | TrendForce
Wearable Technology Market to Hit $186.14 Billion by 2030
11/29/2022 | PRNewswire
Researchers Realize High-speed Uni-Traveling-Carrier Photodiode
11/28/2022 | University of Science and Technology of China
Engineers Improve Electrochemical Sensing by Incorporating Machine Learning
11/28/2022 | Pennsylvania State University
Semiconductor Inspection System Market to Reach $8.9 Billion, Globally, by 2031 at 5.4% CAGR
11/28/2022 | PRNewswire
How Intel Supports a Circular Economy
11/25/2022 | Intel
Pudu Robotics BellaBot Gain Popularity in Carrefour Stores in Poland, Fueling European Growth
11/25/2022 | PRNewswire
Beyond the Smartwatch: Three Wearable Technology Trends to Watch
11/25/2022 | PRNewswire
FEATURED ARTICLES AND COLUMNS:

Nokia Selected by Bharti Airtel for 5G Deployment

August 3, 2022 | Globe Newswire

Nokia announced that it has secured a deal with leading telecom operator Bharti Airtel, for 5G radio access network (RAN) deployment. This multi-year deal follows the recently concluded 5G spectrum auctions and allocation of pan-India spectrum to Bharti Airtel, supporting their ambition to take India into the 5G era.

IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunction with IPC APEX EXPO 2023, the industry’s premier conference and exhibition for the electronics industry.

AIS, Qualcomm Technologies, Inc. and ZTE announced the world’s first 5G NR-DC (New Radio Dual Connectivity) showcase in the field with 2.6GHz and 26GHz, achieving 8.5Gbps peak downlink speed and 2.17Gbps peak uplink speed with a single mobile device.

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Workflow Management Featuring:

  • Laying It on the Line Interview with Jason Sciberras
  • Your Shortage is Someone Else’s Excess by Chintan Sutaria
  • Material Management and Control by Davina McDonnell
  • Modern Inventory Management Secrets by Michael Ford
  • Advanced Packaging Symposium 2022 by Nolan Johnson

An Eye on UHDI Featuring:

  • UHDI: Raising Awareness, and Interesting Questions by Nolan Johnson
  • Understanding the UHDI Market interview with Meredith LeBeau and Todd Brassard
  • The Growing Need for UHDI interview with Jan Pedersen
  • Candor: UHDI Under Development interview with Sunny Patel
  • The UHDI Spectrum interview with Matt Kelly
  • 3D Electronic Devices with Additive Manufacturing by Shavi Spinzi

A Fight to the Physics Featuring:

  • The Physics of PCB Design, a conversation with Eric Bogatin
  • My Experience With Maxwell, by Happy Holden
  • Electronics vs. Physics: Why Vias Don’t Get Hot, by Doug Brooks and Johannes Adam
  • Forget What You Were Taught, by Barry Olney
  • Fitting Physics to Fact, by Martyn Gaudion
  • Physics, Electrical Engineering, and PCB Design, by Tamara Jovanovic
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