FEATURED NEWS AND INFORMATION:

Latest News

CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped
New Today | PR Newswire
Adept Builds a Powerful AI Teammate for Everyone with Oracle and NVIDIA
New Today | PR Newswire
Rockwell Automation Opens Registration to the 31st Annual Automation Fair
New Today | Business Wire
Advantest Selects Rohde & Schwarz to Verify High-Speed Soc Testers
New Today | Rohde & Schwarz
Low-profile Hybrid FPC-to-Board Connector from Hirose Supports 5A in Miniature Footprint
New Today | Hirose Electric Co.
New Programmable Materials Can Sense Their Own Movements
New Today | MIT News Office
LattePanda Team, Global Partners Launch LattePanda 3 Delta, a Pocket-sized Single-board Computer
New Today | PR Newswire
NASA Seeks Student Experiments to Soar in Second TechRise Challenge
08/10/2022 | PR Newswire
Supreme Corporation Named 2022 Top 10 Wearable Technology Solutions Provider
08/10/2022 | PR Newswire
Antaris Closes $4.2 Million Seed Funding Round for Development of Software Solutions for Space
08/10/2022 | PR Newswire
FEATURED ARTICLES AND COLUMNS:

Nokia Selected by Bharti Airtel for 5G Deployment

August 3, 2022 | Globe Newswire

Nokia announced that it has secured a deal with leading telecom operator Bharti Airtel, for 5G radio access network (RAN) deployment. This multi-year deal follows the recently concluded 5G spectrum auctions and allocation of pan-India spectrum to Bharti Airtel, supporting their ambition to take India into the 5G era.

IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunction with IPC APEX EXPO 2023, the industry’s premier conference and exhibition for the electronics industry.

AIS, Qualcomm Technologies, Inc. and ZTE announced the world’s first 5G NR-DC (New Radio Dual Connectivity) showcase in the field with 2.6GHz and 26GHz, achieving 8.5Gbps peak downlink speed and 2.17Gbps peak uplink speed with a single mobile device.

More news...


Supply 'Pain' Management Featuring:

  • Digi-Key Drilling Down on Counterfeit with Levy Olson and Kelsey Lawrence
  • Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
  • Printed Circuit Boards: Past the Lobby and Onto the Floor with U.S. Rep. B. Moore and T. Kelly
  • A Framework for Managing Supply Chain Disruption by Chintan Sutaria
  • Thriving Through Greater EMS Collaboration by Christopher Peters
  • Supply ‘Pain’ Management by Nolan Johnson

Time to Invest? Featuring:

  • The Challenges of the 2022 PCB Market: The Party’s Over by Pete Starkey
  • Is the U.S. Government Ready to Meet the Test of Technological Leadership? by John Mitchell
  • Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
  • Today’s M&A: Right on Target with Tom Kastner
  • Printed Circuit Boards: Past the Lobby and Onto the Floor with Travis Kelly and Rep. Blake Moore
  • PCB Finance Class with Jeff De Serrano

Less Is More Featuring:

  • Material Conservation Demands Stakeholder Buy-in, a conversation with Happy Holden
  • PCB Design Strategies to Reduce Costs, by Barry Olney
  • Design Tips for Lowering Costs of Fab and Assembly, by Cherie Litson
  • Material Conservation: The PCB Designer’s Role, a conversation with Alun Morgan
  • Design for Material Conservation Means Changing Attitudes, a conversation with Dana Korf
  • Design Tips for Inflationary Times by John Watson
  • Practical Packaging Density in PCB Design, by Kelly Dack
Copyright © 2022 I-Connect007. All rights reserved.