FEATURED NEWS AND INFORMATION:

Latest News

SEMI Applauds President Biden’s Signing of CHIPS and Science Act of 2022
New Today | SEMI
Inventec's O-RAN Convention Showcases 5G Smart Factory Applications with a Supply Chain Alliance
New Today | PRNewswire
Gartner Identifies Four Emerging Technologies Expected to Have Transformational Impact on Digital Advertising
New Today | Gartner, Inc.
GlobalFoundries, Qualcomm Announce Extension of Long-Term Agreement to Secure U.S. Supply Through 2028
New Today | Qualcomm Technologies, Inc.
Hon Hai, Monarch Tractor to Build Next-Generation AgTech Equipment
New Today | Business Wire
India Smartphone Market Declined by 1% YoY in 1H22
08/08/2022 | IDC
June Swoon—IC Sales Turn Negative as Economy Weighs on Market
08/08/2022 | IC Insights
Dr. Jennie Hwang Appointed the Chairman of Laboratory Assessment Board of The National Academies
08/08/2022 | H-Technologies Group
Micron Announces Intent to Bring Leading-Edge Memory Manufacturing to the U.S.
08/05/2022 | Micron
Intel Orders Delayed, TSMC Slows Three-Nanometer Expansion, Says TrendForce
08/05/2022 | TrendForce
FEATURED ARTICLES AND COLUMNS:

Nokia Selected by Bharti Airtel for 5G Deployment

August 3, 2022 | Globe Newswire

Nokia announced that it has secured a deal with leading telecom operator Bharti Airtel, for 5G radio access network (RAN) deployment. This multi-year deal follows the recently concluded 5G spectrum auctions and allocation of pan-India spectrum to Bharti Airtel, supporting their ambition to take India into the 5G era.

IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunction with IPC APEX EXPO 2023, the industry’s premier conference and exhibition for the electronics industry.

AIS, Qualcomm Technologies, Inc. and ZTE announced the world’s first 5G NR-DC (New Radio Dual Connectivity) showcase in the field with 2.6GHz and 26GHz, achieving 8.5Gbps peak downlink speed and 2.17Gbps peak uplink speed with a single mobile device.

More news...

SMT007 Magazine

Supply 'Pain' Management Featuring:

  • Digi-Key Drilling Down on Counterfeit with Levy Olson and Kelsey Lawrence
  • Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
  • Printed Circuit Boards: Past the Lobby and Onto the Floor with U.S. Rep. B. Moore and T. Kelly
  • A Framework for Managing Supply Chain Disruption by Chintan Sutaria
  • Thriving Through Greater EMS Collaboration by Christopher Peters
  • Supply ‘Pain’ Management by Nolan Johnson
PCB007 Magazine

Time to Invest? Featuring:

  • The Challenges of the 2022 PCB Market: The Party’s Over by Pete Starkey
  • Is the U.S. Government Ready to Meet the Test of Technological Leadership? by John Mitchell
  • Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
  • Today’s M&A: Right on Target with Tom Kastner
  • Printed Circuit Boards: Past the Lobby and Onto the Floor with Travis Kelly and Rep. Blake Moore
  • PCB Finance Class with Jeff De Serrano
Design007 Magazine

Less Is More Featuring:

  • Material Conservation Demands Stakeholder Buy-in, a conversation with Happy Holden
  • PCB Design Strategies to Reduce Costs, by Barry Olney
  • Design Tips for Lowering Costs of Fab and Assembly, by Cherie Litson
  • Material Conservation: The PCB Designer’s Role, a conversation with Alun Morgan
  • Design for Material Conservation Means Changing Attitudes, a conversation with Dana Korf
  • Design Tips for Inflationary Times by John Watson
  • Practical Packaging Density in PCB Design, by Kelly Dack
Electronics Industry News Events eBooks RTW
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © 2022 I-Connect007. All rights reserved.