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Indium’s Jason Chou to Present at SEMICON Taiwan
New Today | Indium Corporation
GrayMatter Robotics Raises $20M Series A to Fuel Continued Growth and Expansion
New Today | PRNewswire
CyberOptics to Deliver Technical Presentation at the Heterogeneous Integration Summit by SEMICON Taiwan
New Today | CyberOptics Corporation
NCKU Researchers Develop the First Dual-mode Piezotronics-based Force Sensor
New Today | PRNewswire
Keysight Extends Collaboration with Synopsys to Validate Complex RF and Millimeter Wave Design
New Today | Business Wire
5G Time Critical Services Boost Productivity and Efficiency of Industrial Operations
08/15/2022 | Business Wire
How Artificial Intelligence Could Lower Nuclear Energy Costs
08/15/2022 | Business Wire
Chery Fully Embarks on the New Energy Layout
08/15/2022 | Business Wire
Global 2Q22 DRAM Revenue Grows by 6.5% QoQ
08/15/2022 | TrendForce
Intel Introduces First Protections Against Certain Physical Threats
08/15/2022 | Intel
FEATURED ARTICLES AND COLUMNS:

Nokia Selected by Bharti Airtel for 5G Deployment

August 3, 2022 | Globe Newswire

Nokia announced that it has secured a deal with leading telecom operator Bharti Airtel, for 5G radio access network (RAN) deployment. This multi-year deal follows the recently concluded 5G spectrum auctions and allocation of pan-India spectrum to Bharti Airtel, supporting their ambition to take India into the 5G era.

IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunction with IPC APEX EXPO 2023, the industry’s premier conference and exhibition for the electronics industry.

AIS, Qualcomm Technologies, Inc. and ZTE announced the world’s first 5G NR-DC (New Radio Dual Connectivity) showcase in the field with 2.6GHz and 26GHz, achieving 8.5Gbps peak downlink speed and 2.17Gbps peak uplink speed with a single mobile device.

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SMT007 Magazine

Supply 'Pain' Management Featuring:

  • Digi-Key Drilling Down on Counterfeit with Levy Olson and Kelsey Lawrence
  • Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
  • Printed Circuit Boards: Past the Lobby and Onto the Floor with U.S. Rep. B. Moore and T. Kelly
  • A Framework for Managing Supply Chain Disruption by Chintan Sutaria
  • Thriving Through Greater EMS Collaboration by Christopher Peters
  • Supply ‘Pain’ Management by Nolan Johnson
PCB007 Magazine

Board Pricing Strategies Featuring:

  • Tune Up Your Pricing Strategies, by Andy Shaughnessy
  • Time for a Price Hike? with Dave Ryder and Dan Beaulieu
  • Board Pricing Challenges and Opportunities with James Hofer
  • 
Price Increases Are Here to Stay with Alun Morgan
  • Pricing Strategies with Michael Carano
  • FCT: Powerful Growth in the Flex Segment with Carey Burkett
Design007 Magazine

Less Is More Featuring:

  • Material Conservation Demands Stakeholder Buy-in, a conversation with Happy Holden
  • PCB Design Strategies to Reduce Costs, by Barry Olney
  • Design Tips for Lowering Costs of Fab and Assembly, by Cherie Litson
  • Material Conservation: The PCB Designer’s Role, a conversation with Alun Morgan
  • Design for Material Conservation Means Changing Attitudes, a conversation with Dana Korf
  • Design Tips for Inflationary Times by John Watson
  • Practical Packaging Density in PCB Design, by Kelly Dack
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