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Intel Teams Up with Aible to Fast-Track Enterprise Analytics and AI
New Today | Intel
IPC Lauds Passage of 'CHIPS and Science' Act; Electronics Industry Calls for a Holistic Approach to Reviving Domestic Electronics Capabilities
New Today | IPC
FACT SHEET: CHIPS and Science Act Will Lower Costs, Create Jobs, Strengthen Supply Chains, and Counter China
New Today | The White House
SIA Applauds Enactment of CHIPS Act
New Today | SIA
Indium to Showcase GalliTHERM Liquid Metal Technology and No-Clean Semiconductor Flux at SEMICON Taiwan
New Today | Indium Corporation
SEMI Applauds President Biden’s Signing of CHIPS and Science Act of 2022
New Today | SEMI
Inventec's O-RAN Convention Showcases 5G Smart Factory Applications with a Supply Chain Alliance
New Today | PRNewswire
Gartner Identifies Four Emerging Technologies Expected to Have Transformational Impact on Digital Advertising
New Today | Gartner, Inc.
GlobalFoundries, Qualcomm Announce Extension of Long-Term Agreement to Secure U.S. Supply Through 2028
New Today | Qualcomm Technologies, Inc.
Hon Hai, Monarch Tractor to Build Next-Generation AgTech Equipment
New Today | Business Wire
FEATURED ARTICLES AND COLUMNS:

Nokia Selected by Bharti Airtel for 5G Deployment

August 3, 2022 | Globe Newswire

Nokia announced that it has secured a deal with leading telecom operator Bharti Airtel, for 5G radio access network (RAN) deployment. This multi-year deal follows the recently concluded 5G spectrum auctions and allocation of pan-India spectrum to Bharti Airtel, supporting their ambition to take India into the 5G era.

IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunction with IPC APEX EXPO 2023, the industry’s premier conference and exhibition for the electronics industry.

AIS, Qualcomm Technologies, Inc. and ZTE announced the world’s first 5G NR-DC (New Radio Dual Connectivity) showcase in the field with 2.6GHz and 26GHz, achieving 8.5Gbps peak downlink speed and 2.17Gbps peak uplink speed with a single mobile device.

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PCB007 Magazine

Time to Invest? Featuring:

  • The Challenges of the 2022 PCB Market: The Party’s Over by Pete Starkey
  • Is the U.S. Government Ready to Meet the Test of Technological Leadership? by John Mitchell
  • Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
  • Today’s M&A: Right on Target with Tom Kastner
  • Printed Circuit Boards: Past the Lobby and Onto the Floor with Travis Kelly and Rep. Blake Moore
  • PCB Finance Class with Jeff De Serrano
Design007 Magazine

Less Is More Featuring:

  • Material Conservation Demands Stakeholder Buy-in, a conversation with Happy Holden
  • PCB Design Strategies to Reduce Costs, by Barry Olney
  • Design Tips for Lowering Costs of Fab and Assembly, by Cherie Litson
  • Material Conservation: The PCB Designer’s Role, a conversation with Alun Morgan
  • Design for Material Conservation Means Changing Attitudes, a conversation with Dana Korf
  • Design Tips for Inflationary Times by John Watson
  • Practical Packaging Density in PCB Design, by Kelly Dack
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