FEATURED NEWS AND INFORMATION:

Latest News

SEMICON West 2022 Hybrid to Highlight CHIPS Act, Supply Chain Resilience
New Today | SEMI
Intel Foundry Services Forms Alliance to Enable Design in the Cloud
New Today | Intel
Qualcomm Joins The Diversity Charter
New Today | Qualcomm Technologies, Inc.
ULVAC-PHI Launches Sales of Latest XPS System that Accelerates Battery Research and Development
New Today | ACN Newswire
Compute, Storage Infrastructure Spending Grew Strongly Across Cloud and Non-Cloud IT Environments in 1Q22
07/04/2022 | IDC
Cross-Generation Experience Is the Foundation for 5G Success and 5G Is on the Fast Lane in Latin America
07/04/2022 | PRNewswire
NEC Expands Global Solutions Delivery Capacity with Acquisition of Aspire Technology
07/04/2022 | ACN Newswire
How Technology Contributes to Economical Gaps in Southeast Asia
07/04/2022 | ACN Newswire
Cadence Advances Radar, Lidar, Communications Processing for Automotive, Consumer and Industrial Markets
07/04/2022 | Cadence Design Systems, Inc.
Major U.S. Holiday Today: Independence Day
07/04/2022 | I-Connect007 Editorial Team
FEATURED ARTICLES AND COLUMNS:

IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunction with IPC APEX EXPO 2023, the industry’s premier conference and exhibition for the electronics industry.

AIS, Qualcomm Technologies, Inc. and ZTE announced the world’s first 5G NR-DC (New Radio Dual Connectivity) showcase in the field with 2.6GHz and 26GHz, achieving 8.5Gbps peak downlink speed and 2.17Gbps peak uplink speed with a single mobile device.

Survey: CEO Optimism Hits 10-year High

January 19, 2022 | PRNewswire

CEO perception of threats varies by geography. More than half, 58%, of CEOs in Asia-Pacific are very or extremely concerned about health risks in the coming year (the exception is China, where only 42% of CEOs are highly concerned about health risks).

More news...


Solving Data Security Featuring:

  • Time to Get Serious About CMMC Readiness Interview with Divyash Patel
  • Excerpt: Don’t Hit the Snooze on Cybersecurity by Divyash Patel
  • Zombie Cars: The Next Pandemic Is Digital by Michael Ford
  • How Important Is Trust? By Randy Cherry
  • CMMC 2.0: Are You Ready? Interview with Ryan Bonner
  • Business Email Compromise: The $43 Billion Scam an announcement from the FBI 
  • The Virtual Via Drum by Mehul Dave

The Plating Issue Featuring:

  • Proper Plating, by Andy Shaughnessy
  • PCB Plating Still Comes Down to Physics, a conversation with Mike Carano
  • Plating Offers Plenty of Challenges—and Opportunities, a conversation with Chris Bonsell
  • Plating in Electronic Applications, by George Milad
  • Plating on Silver: What’s Old Is New Again, by Denis Jacques
  • Book Excerpt: Automation and Advanced Procedures in PCB Fabrication, by Happy Holden

DWM: Design With Manufacturing Featuring:

  • Will DWM Unite the Product Development Family? by Andy Shaughnessy
  • What Happens When You Assume? a conversation with Dana Korf
  • Designing With the 5Ws and Other Acronyms, by Kelly Dack
  • DWM: A Rose by Any Other Name, by Patrick McGoff
  • Altimade Puts Designers and Manufacturers Together, with Ted Pawela and Misha Govshteyn
  • Mastering the Art of Communication With Manufacturers, by Kyle Burk
  • Is DWM Just Another Buzzword? by Tara Dunn
  • Producing Diverse Designs in Concert With Manufacturing, by Scott Miller
Copyright © 2022 I-Connect007. All rights reserved.