FEATURED NEWS AND INFORMATION:

Latest News

How Intel Supports a Circular Economy
11/25/2022 | Intel
Pudu Robotics BellaBot Gain Popularity in Carrefour Stores in Poland, Fueling European Growth
11/25/2022 | PRNewswire
Beyond the Smartwatch: Three Wearable Technology Trends to Watch
11/25/2022 | PRNewswire
Intel Solutions Help to Combat Modern Slavery
11/24/2022 | Intel
Compound Semiconductor Market Will Reach $55.42B by 2028 with CAGR of 5.48%
11/24/2022 | PRNewswire
Dabeeo Partners with Maxar Technology to Expand the Global Satellite Data Analysis Market
11/24/2022 | Business Wire
Purdue University, GlobalFoundries Partner to Strengthen Research and Development, Semiconductor Education
11/23/2022 | GlobalFoundries
Silicon Labs CEO Matt Johnson Elected Chair of Semiconductor Industry Association
11/23/2022 | SIA
Chengdu Unleashes More Opportunities for Manufacturing Industry
11/23/2022 | PRNewswire
5G Fixed Wireless Access Market to Surpass $121B by 2032 Amid Increased Adoption of Connected Devices
11/23/2022 | PRNewswire
FEATURED ARTICLES AND COLUMNS:

Nokia Selected by Bharti Airtel for 5G Deployment

August 3, 2022 | Globe Newswire

Nokia announced that it has secured a deal with leading telecom operator Bharti Airtel, for 5G radio access network (RAN) deployment. This multi-year deal follows the recently concluded 5G spectrum auctions and allocation of pan-India spectrum to Bharti Airtel, supporting their ambition to take India into the 5G era.

IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunction with IPC APEX EXPO 2023, the industry’s premier conference and exhibition for the electronics industry.

AIS, Qualcomm Technologies, Inc. and ZTE announced the world’s first 5G NR-DC (New Radio Dual Connectivity) showcase in the field with 2.6GHz and 26GHz, achieving 8.5Gbps peak downlink speed and 2.17Gbps peak uplink speed with a single mobile device.

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Workflow Management Featuring:

  • Laying It on the Line Interview with Jason Sciberras
  • Your Shortage is Someone Else’s Excess by Chintan Sutaria
  • Material Management and Control by Davina McDonnell
  • Modern Inventory Management Secrets by Michael Ford
  • Advanced Packaging Symposium 2022 by Nolan Johnson

An Eye on UHDI Featuring:

  • UHDI: Raising Awareness, and Interesting Questions by Nolan Johnson
  • Understanding the UHDI Market interview with Meredith LeBeau and Todd Brassard
  • The Growing Need for UHDI interview with Jan Pedersen
  • Candor: UHDI Under Development interview with Sunny Patel
  • The UHDI Spectrum interview with Matt Kelly
  • 3D Electronic Devices with Additive Manufacturing by Shavi Spinzi

A Fight to the Physics Featuring:

  • The Physics of PCB Design, a conversation with Eric Bogatin
  • My Experience With Maxwell, by Happy Holden
  • Electronics vs. Physics: Why Vias Don’t Get Hot, by Doug Brooks and Johannes Adam
  • Forget What You Were Taught, by Barry Olney
  • Fitting Physics to Fact, by Martyn Gaudion
  • Physics, Electrical Engineering, and PCB Design, by Tamara Jovanovic
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