Latest News

Micron Announces Intent to Bring Leading-Edge Memory Manufacturing to the U.S.
08/05/2022 | Micron
Intel Orders Delayed, TSMC Slows Three-Nanometer Expansion, Says TrendForce
08/05/2022 | TrendForce
Nokia Selected by Orange Egypt to Modernize Network for Increased Reliability, Security and Operational Efficiencies
08/05/2022 | Nokia
C&K Develops Ultra Low Current Detect Switch to Reduce Power Consumption
08/05/2022 | C&K
Johanson Enhances WiFi 6E and WiFi 7 and Coexistence Filter Solutions
08/04/2022 | Johanson Technology
Keysight, Nokia Collaborate to Demonstrate the First 800 Gigabit Ethernet Readiness and Interoperability Public Test
08/04/2022 | Business Wire
Cadence Library Characterization Solution Accelerates Delivery and Enhances Quality of Arm Memory Products
08/04/2022 | Cadence Design Systems, Inc.
Intel, Industry Collaborators Show Enhanced vRAN Capabilities on a Global Scale
08/04/2022 | Intel
Universal Joins ASIC, Effort to Fuel America’s Advanced Semiconductor Development
08/03/2022 | Universal Instruments
NASA Space Robotics Dive into Deep-Sea Work
08/03/2022 | NASA

Nokia Selected by Bharti Airtel for 5G Deployment

August 3, 2022 | Globe Newswire

Nokia announced that it has secured a deal with leading telecom operator Bharti Airtel, for 5G radio access network (RAN) deployment. This multi-year deal follows the recently concluded 5G spectrum auctions and allocation of pan-India spectrum to Bharti Airtel, supporting their ambition to take India into the 5G era.

IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunction with IPC APEX EXPO 2023, the industry’s premier conference and exhibition for the electronics industry.

AIS, Qualcomm Technologies, Inc. and ZTE announced the world’s first 5G NR-DC (New Radio Dual Connectivity) showcase in the field with 2.6GHz and 26GHz, achieving 8.5Gbps peak downlink speed and 2.17Gbps peak uplink speed with a single mobile device.

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Supply 'Pain' Management Featuring:

  • Digi-Key Drilling Down on Counterfeit with Levy Olson and Kelsey Lawrence
  • Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
  • Printed Circuit Boards: Past the Lobby and Onto the Floor with U.S. Rep. B. Moore and T. Kelly
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Time to Invest? Featuring:

  • The Challenges of the 2022 PCB Market: The Party’s Over by Pete Starkey
  • Is the U.S. Government Ready to Meet the Test of Technological Leadership? by John Mitchell
  • Q4 Concerns: Hold On to Your Hats with Shawn DuBravac
  • Today’s M&A: Right on Target with Tom Kastner
  • Printed Circuit Boards: Past the Lobby and Onto the Floor with Travis Kelly and Rep. Blake Moore
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Field Solvers Featuring:

With Field Solvers, GIGO Hurts, by Andy Shaughnessy
Surveying the Land of Field Solvers, a conversation with Todd Westerhoff and Bill Hargin
The Great Divide in PCB Simulation Software, by Zach Peterson
Field Solver Finesse for Modelling Transmission Lines by Martyn Gaudion
Cadence Provides “Clarity” in Design Tool, a conversation with Brad Griffin
2D Field Solver—An Essential Tool for High-Speed PCB Design, by Barry Olney
The Practical Side of Using EM Solvers, by Heidi Barnes


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