FEATURED NEWS AND INFORMATION:

Latest News

Qualcomm Announces Long-Range Compact Macro Platform for Cost-Effective Outdoor mmWave Deployments
New Today | Qualcomm Technologies, Inc.
Siemens’ Hour of Engineering to Spark Middle School Interest in STEM
New Today | Siemens
Smartphone Production Fell to About 289 Million Units for 3Q22
New Today | TrendForce
Samsung Electronics, NAVER Team Up to Develop Semiconductor Solutions Optimized for Hyperscale AI
12/06/2022 | Business Wire
Enterprise SSD Revenue Slid to $5.22B for 3Q22
12/06/2022 | TrendForce
Global Semiconductor Sales Decrease 0.3% Month-to-Month in October
12/06/2022 | SIA
Zuken, CSA Catapult Present Results for Optimization of Tools for Design of Power Modules
12/05/2022 | Zuken
Intel Research Fuels Moore’s Law and Paves the Way to a Trillion Transistors by 2030
12/05/2022 | Intel
WHMA Announces Call for Nominations for Recognition Awards
12/05/2022 | IPC
China Overtakes USA in Robot Density
12/05/2022 | IFR
FEATURED ARTICLES AND COLUMNS:

Nokia Selected by Bharti Airtel for 5G Deployment

August 3, 2022 | Globe Newswire

Nokia announced that it has secured a deal with leading telecom operator Bharti Airtel, for 5G radio access network (RAN) deployment. This multi-year deal follows the recently concluded 5G spectrum auctions and allocation of pan-India spectrum to Bharti Airtel, supporting their ambition to take India into the 5G era.

IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunction with IPC APEX EXPO 2023, the industry’s premier conference and exhibition for the electronics industry.

AIS, Qualcomm Technologies, Inc. and ZTE announced the world’s first 5G NR-DC (New Radio Dual Connectivity) showcase in the field with 2.6GHz and 26GHz, achieving 8.5Gbps peak downlink speed and 2.17Gbps peak uplink speed with a single mobile device.

More news...


IPC APEX EXPO 2023 Preshow Issue Featuring:

  • Advance In a New Era by Dr. John Mitchell
  • Let’s Get Technical by Julia Gumminger
  • Standards Committees: Moving Faster, Working Better interview with Teresa Rowe
  • STEM Program: Evolving and Growing by Charlene Gunter du Plessis
  • Women In Electronics Reception by Alicia Balonek
  • It’s All in the App by Kim DiCianni

An Eye on UHDI Featuring:

  • UHDI: Raising Awareness, and Interesting Questions by Nolan Johnson
  • Understanding the UHDI Market interview with Meredith LeBeau and Todd Brassard
  • The Growing Need for UHDI interview with Jan Pedersen
  • Candor: UHDI Under Development interview with Sunny Patel
  • The UHDI Spectrum interview with Matt Kelly
  • 3D Electronic Devices with Additive Manufacturing by Shavi Spinzi

A Fight to the Physics Featuring:

  • The Physics of PCB Design, a conversation with Eric Bogatin
  • My Experience With Maxwell, by Happy Holden
  • Electronics vs. Physics: Why Vias Don’t Get Hot, by Doug Brooks and Johannes Adam
  • Forget What You Were Taught, by Barry Olney
  • Fitting Physics to Fact, by Martyn Gaudion
  • Physics, Electrical Engineering, and PCB Design, by Tamara Jovanovic
Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.