SPOTLIGHT
Major Chinese Memory Companies Arrange Trial Production to Begin in 2H18
According to DRAMeXchange, a division of TrendForce, China has entered the semiconductor sector and focused on the development of domestic memory...
ESPResSo, an Ambitious EU Funded Collaboration to Make Perovskite Solar Cells a Market Reality
Imec and partner in EnergyVille, has been named the coordinator of an ambitious 3-year European Union (EU) funded project, “ESPResSo”...
3D Nanoprinting Facilitates Communication with Light
At Karlsruhe Institute of Technology (KIT), researchers have developed a flexible and efficient concept to combine optical components in compact...
Integrating Optical Components Into Existing Chip Designs
Two and a half years ago, a team of researchers led by groups at MIT, the University of California at Berkeley, and Boston University announced a...
For Nuclear Weapons Reduction, a Way to Verify Without Revealing
In past negotiations aimed at reducing the arsenals of the world’s nuclear superpowers, chiefly the U.S. and Russia, a major sticking point has...
Surrey Creates New Tool to Speed up the Design of Wearable Tech
People could soon power items such as their mobile phones or personal health equipment by simply using their daily movements, thanks to a new...
Robot Helper: 'Does It Get along with My Cat?'
The term human-machine interface makes us spontaneously think of the gigantic humanoid fighting machines controlled by pilots in Guillermo del Toro’s action film “Pacific Rim” or of the red eye of...
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Latest EIN007
This issue Automotive Electronics Featuring:
Vehicle Electrification: Disrupting the Automotive Industry and Beyond, by Chandran Nair, National Instruments
Solving Reliability and Thermal Management Challenges in Automotive Electronics, an interview with Paul Salerno
System-Driven Approach Ensures Automotive Electronics Assembly Success, an interview with Mathieu Kury
Under the Hood: Solder Joint Reliability, by Burton Carpenter, NXP Semiconductors Inc.
Automotive Electronics Still in the Front Seat, by Stephen Las Marias, I-Connect007
This issue Automotive Electronics... and More! Featuring:
Autonomous Transportation: Using Disruptive Technologies to Create Social Disruption and Change, by Dan Feinberg
Future Automotive Requirements for PCBs, Dr. Christian Klein
International Automotive Task Force (IATF) 16949 Standard, Explained, by Steve Williams
E-Textiles—the Wild Frontier, by Tara Dunn
Automotive, the Electronics Industry's New Driver, by Patty Goldman
This issue Future Vehicles Featuring:
Experts Discussion: Dan Feinberg on Automotive Electronics, a conversation with Dan Feinberg
Zuken Pulling Ahead in Automotive PCB Design, a conversation with Humair Mandavia
Porsche Engineering…by Design, a conversation with Thomas Wischnack
Autonomous Vehicle Electronics: Reliability Challenges and Solutions, by James McLeish
ITEQ Ready for Autonomous and Electric Vehicles of the Future, a conversation with Tarun Amla
Graphene Heat Sinks: Thermal Management Options, From Autos to Tablets, by Pete Christensen
EDADOC a Driving Force in China’s Automotive Electronics Design, a conversation with William Zhou and Wen Ling