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Revealing Crystal Structures Robotically
12/02/2022 | ACN Newswire
IDC Tracker Forecast Sees Further Contraction for the Global PC, Tablet Markets
12/02/2022 | IDC
Siemens Energy, Georgia Tech Announce Signing of Master Research Agreement
12/02/2022 | Business Wire
Keysight Delivers New Solar Array Simulator Solution for Satellite Power Systems
12/02/2022 | Business Wire
TechInsights Acquires IC Knowledge LLC in Expansion of Semiconductor Market Analysis Content
12/02/2022 | Business Wire
SEMI Commends European Council’s Progress on Chips Act, Urges Swift Start of Trialogue Negotiations
12/02/2022 | SEMI
KYZEN’s Sherry Stepp Receives Women of Excellence in Metal Forming and Fabricating Award
12/01/2022 | Kyzen
Omnitron Sensors Solves Reliability, Size, Cost Issues with LiDARs
12/01/2022 | PRNewswire
Amtech Systems Books Large Repeat Order Driven by EV Growth
12/01/2022 | Amtech Systems, Inc.
Keysight, MediaTek Achieve 5G Connection Based on 3GPP Release 17 and RedCap Technology
12/01/2022 | Business Wire

Nokia Selected by Bharti Airtel for 5G Deployment

August 3, 2022 | Globe Newswire

Nokia announced that it has secured a deal with leading telecom operator Bharti Airtel, for 5G radio access network (RAN) deployment. This multi-year deal follows the recently concluded 5G spectrum auctions and allocation of pan-India spectrum to Bharti Airtel, supporting their ambition to take India into the 5G era.

IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunction with IPC APEX EXPO 2023, the industry’s premier conference and exhibition for the electronics industry.

AIS, Qualcomm Technologies, Inc. and ZTE announced the world’s first 5G NR-DC (New Radio Dual Connectivity) showcase in the field with 2.6GHz and 26GHz, achieving 8.5Gbps peak downlink speed and 2.17Gbps peak uplink speed with a single mobile device.

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IPC APEX EXPO 2023 Preshow Issue Featuring:

  • Advance In a New Era by Dr. John Mitchell
  • Let’s Get Technical by Julia Gumminger
  • Standards Committees: Moving Faster, Working Better interview with Teresa Rowe
  • STEM Program: Evolving and Growing by Charlene Gunter du Plessis
  • Women In Electronics Reception by Alicia Balonek
  • It’s All in the App by Kim DiCianni

An Eye on UHDI Featuring:

  • UHDI: Raising Awareness, and Interesting Questions by Nolan Johnson
  • Understanding the UHDI Market interview with Meredith LeBeau and Todd Brassard
  • The Growing Need for UHDI interview with Jan Pedersen
  • Candor: UHDI Under Development interview with Sunny Patel
  • The UHDI Spectrum interview with Matt Kelly
  • 3D Electronic Devices with Additive Manufacturing by Shavi Spinzi

A Fight to the Physics Featuring:

  • The Physics of PCB Design, a conversation with Eric Bogatin
  • My Experience With Maxwell, by Happy Holden
  • Electronics vs. Physics: Why Vias Don’t Get Hot, by Doug Brooks and Johannes Adam
  • Forget What You Were Taught, by Barry Olney
  • Fitting Physics to Fact, by Martyn Gaudion
  • Physics, Electrical Engineering, and PCB Design, by Tamara Jovanovic
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