SPOTLIGHT
A New Way for Designing Electronics
A team from the University of Southampton has invented a new way for designing electronic systems that incorporates the best from both analogue and digital paradigms. The approach combines the computational power of analogue...
Carbon Nanotube Optics Poised to Provide Pathway to Optical-Based Quantum Cryptography and Quantum Computing
Researchers at Los Alamos and partners in France and Germany are exploring the enhanced potential of carbon nanotubes as single-photon emitters for...
SEMI-FlexTech Invites Proposals for Flexible Hybrid Electronics Advances
FlexTech, a SEMI Strategic Association Partner, is now soliciting proposals for projects that advance flexible hybrid electronics (FHE) for sensors,...
Global Demand and Supply for Automotive Display Systems Expected to Maintain Healthy Growth in 2018
The global demand for automotive display systems is expected to continue a strong growth path in 2018, according to recent analysis from business...
Consumer Adoption, Interest in Wireless Charging Continues to Surge, New International Survey Shows
Consumer adoption of wireless charging technology has increased dramatically, according to a new survey conducted by the Wireless Power Consortium...
Purdue Phoneme Project Creates New Haptic Communications Future
Communication could step beyond reading a cellular phone screen with a new technique by Purdue College of Engineering researchers to learn and read...
Worldwide Technology Spending on the Internet of Things to Reach $1.2 Trillion in 2022
International Data Corporation (IDC) today announced publication of the latest Worldwide Semiannual Internet of Things Spending Guide (version 2H17)....
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Latest EIN007
This issue Flex Circuit Assembly Featuring:
Tackling the Challenges in Flexible Circuit Assembly
Flex Circuit Assembly: Challenges and Strategies for Success
Reflow Perspectives to Flex Circuit Assemblies
Conversation with… Miraco: Strategies for Successful Flex Circuit Assembly
Conversation with… Vexos: Doing it Right the First Time
Conversation with… Thermaltronics: Addressing Temperature Challenges in Flex Circuit Rework
This issue Wet Processing Trends 2018 Featuring:
Experts Discussion: MacDermid Enthone Talks Wet Processing in 2018, by the I-Connect007 Editorial Team
Autocatalytic Gold: How it Fits as a Final Finish, by Rick Nichols
Developments in Wet Processing: Beyond Spraying and Dipping, by Marc Ladle
Advanced Copper Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper, by Saminda Dharmarathna, et al.
Characteristics of New Electroless Au/Pd/Au Process for Fine Line Application, by Tetsuya Sasamura, et al.
PTH Failure Mechanisms and Using IST as a Tool, Part 1, by Michael Carano
This issue Multi-board Design Featuring:
Multi-board Design: Multiple Challenges?, by Andy Shaughnessy
Dave Wiens Discusses Multi-board Design Techniques, a conversation with Dave Wiens
3D Convergence of Multi-board PCB and IC Packaging Design, by Bob Potock
Multi-board Design with Altium’s Ben Jordan, a conversation with Ben Jordan