FEATURED NEWS AND INFORMATION:

Latest News

Cadence Collaborates with Samsung Foundry
04/09/2021 | Cadence Design Systems, Inc.
Graphene 'Smart Surfaces' Now Tunable for Visible Spectrum
04/09/2021 | University of Manchester
A Breakthrough that Enables Practical Semiconductor Spintronics
04/09/2021 | Karin Söderlund Leifler, Linköping University
Olympus Opens New Global HQ for Therapeutic Solutions Division, U.S. Medical Business
04/08/2021 | ACN Newswire
NEC, Cisco Expand Strategic Partnership
04/08/2021 | ACN Newswire
New Approach Brings Industry a Step Closer to Transparent Electronics
04/08/2021 | Fleet
AMD, Xilinx Stockholders Approve Proposed Acquisition
04/08/2021 | AMD
Fujitsu, Trend Micro Demonstrate Solution to Secure Private 5G
04/08/2021 | ACN Newswire
Lithium Demand Could Get Boost from Future Fusion Facilities
04/07/2021 | PRNewswire
SEMI Provides U.S. Commerce Department with Semiconductor Supply Chain Risks Analysis
04/07/2021 | SEMI
FEATURED ARTICLES AND COLUMNS:

Headset Advisor: Can You Hear Me Now?

February 15, 2021 | I-Connect007 Editorial Team

Dan Feinberg and Nolan Johnson recently spoke with David Merritt of Headset Advisor, a company that specializes in supplying headsets to businesses and call centers of all sizes. They discuss the company’s business model, how the pandemic has affected their business, and how the needs of employees have changed in the past year.

CES 2021 Coverage: A Virtual Show Floor

January 17, 2021 | Dan Feinberg, Technology Editor, I-Connect007

I write this on the final day of CES 2021, and I expect CES will never be the same. It will not revert back to what it once was. I also cannot imagine it stays a totally virtual show; in doing so, I feel it would fail. Does that mean I think the 2021 show was a failure? No, not at all. In fact, it was a very good event, particularly in light of the medical and political pandemic that we have been enduring.

My View from CES 2021: Day 1

January 12, 2021 | Dan Feinberg, Technology Editor, I-Connect007

What a difference a year makes. One year ago, those of us who cover and attend CES were going from one press conference to the next; this year, we are at home going from link to link. Confusing and challenging, yes, but there are some advantages: no masks, only five steps to get to a restroom, being able to have three of four events or more displaying on your screens at the same time and being able to download press kits as needed. So far, many new devices are being introduced, but of course, they are all online, so you wonder if some of them really exist or are truly operational as yet.

More news...


Driving Cost Out of Your Supply Chain Featuring:

  • Supply Chain Cost Management is a Holistic Business Approach Interview with Tim Rodgers
  • A New Captive PCB Facility in the U.S. Interview with Jessi Hall and Diane Maceri
  • What Makes a Great Supply Chain Manager? by Tim McLean
  • 10 Ways to Identify Counterfeit ICs by Bill Cardoso
  • IPC Managers Forum: Vertical Integration by Pete Starkey
  • Overcoming Component Selection and Sourcing Challenges by John Watson
  • Driving Down Cost in the Supply Chain by Meghan Zou

The Future of PCBs in Transportation Featuring:

  • PCB Requirements for E-Mobility Interview with Christian Klein
  • The Future is Electric by KJ McCann and Brian Zirlin
  • TTM on the Future of Transportation Design by Walter Olbrich
  • EV Industry Facing Bottleneck Challenges Interview with Eduardo Benmayor
  • Simplified Assembly of Aluminum Flexible Circuits by Tara Dunn
  • Process Survivability, Reliability and Robustness Testing for EVs by Bob Neves

The Simulation Issue Featuring:

  • Barry Olney’s High-Speed Simulation Primer, Interview with Barry Olney
  • Bridging the Simulation Tool Divide, Interview with Todd Westerhoff
  • Simulation Stackup and Signal Integrity, by Martyn Gaudion
  • Why We Simulate, by Bill Hargin
  • Alternatives to Simulation, by Dan Beeker
  • Using Simulation to Assist With PCB Design, by John Coonrod
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