FEATURED NEWS AND INFORMATION:

Latest News

Wireless Charging for Wearables and Beyond
New Today | PRNewswire
First Single-Chip Network Synchronization Solution Provides Ultra Precise Timing for 5G Radio Access Equipment
New Today | Business Wire
Global Smartphone Market Grew 13.2% in Q2
New Today | Business Wire
Siemens Extends Xcelerator Portfolio
New Today | Siemens
InSight Mission Unveils Interior of Mars
07/29/2021 | Imperial College London
Bringing Students into the Next Industrial Revolution
07/29/2021 | Carnegie Mellon University
Silicon Wafer Shipments Reach New High in Q2 2021
07/29/2021 | SEMI
Fujitsu, HFR Networks Enhance Smart xHaul for 5G Transport
07/29/2021 | Business Wire
Mars Rover Mission Only Just Beginning One Year After its Launch
07/28/2021 | Purdue University
Keysight Gains Approval of Test Cases for Validating 5G New Radio mmWave Devices in Standalone Mode
07/28/2021 | Business Wire
FEATURED ARTICLES AND COLUMNS:

Averatek Pushing Boundaries of Additive and Semi-Additive Processes

July 12, 2021 | Andy Shaughnessy, Design007 Magazine

At the IEEE International Microwave Symposium show in Atlanta, I met with Tara Dunn, I-Connect007 columnist and VP of marketing and business development for Averatek. We sat down at the show and discussed the past year and a half, and after joking about how we felt like we were on an episode of The Twilight Zone, Tara gave me an update on Averatek’s continuing research into additive and semi-additive technologies.

The Top Five Reasons Products Fail EMI Testing

May 12, 2021 | Kenneth Wyatt, Wyatt Technical Services

The three top product failures that Ken Wyatt sees constantly in his consulting practice are radiated emissions, radiated susceptibility, and electrostatic discharge. After reviewing and testing hundreds of products over the years, he's come to the conclusion that products fail these tests for five common reasons. Read on!

Exciting Advances From NVIDIA’s GPU

May 3, 2021 | Dan Feinberg, I-Connect007

NVIDIA’s Graphics Processing Technology Conference was, as expected, a showcase of new developments, as well as an opportunity for engineers and developers to learn, enhance skills, and discuss new ideas. Just hearing about all the amazing new developments and the accelerating expansion of AI in virtually all aspects of modern society gives those who attended a better idea of just how much AI is and will continue to change their work and our world.

More news...


Reliability Featuring:

  • Cleanliness Behind Many Assembly Challenges Interview with Eric Camden
  • The Meaning of (PCB) Life by Bob Neves
  • Ductility is Your Greatest 'Alloy'—Avoiding Drop Shock by Ranjit Pandher
  • How to Troubleshoot Your Testing Processes by Graham Naisbitt
  • IPC-WP-019: The How to Behind the Cleanliness Requirements in IPC J-STD-001G by Debora Obitz

Inflation—Supply and Demand Featuring:

  • Riding the Wave of Copper Inflation Pricing Interview with Mark Goodwin
  • Feeling The Supply Chain Squeeze Interview with Joe D’Ambrisi
  • The Demand for Copper Interview with Michael Coll and Chris Stevens
  • Economic Drivers Takes Us ‘Up, Up, and Away!’ by Shawn DuBravac
  • Working Through Shortages by Anaya Vardya
  • Navigating Current Market Dynamics Interview with Mark McMeen
  • Isola Responding to the Market Interview with Travis Kelly

Ask the Experts Featuring:

  • Ask the Design Experts, by Andy Shaughnessy
  • Meet the Experts
  • Ask the Experts: 16 of Your Burning Questions... Answered
  • Ask the Experts—PDN Filters, by Istvan Novak
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