Rising Material Costs Continue to Affect LED Industry
January 5, 2017 | TrendForceEstimated reading time: 1 minute
The LED chip subsidiary of China’s major LED supplier San’an Optoelectronics has just announced an 8% price hike for some its products that will take effect on January 10, 2017. Following four major waves of price increases implemented by participants in the global LED industry during 2016, San’an Opto is now leading another major price adjustment at the start of 2017. LEDinside, a division of TrendForce, believes that the main factor behind these price hikes is the rising costs of raw materials in the upstream of the supply chain, while warming demand and extremely low quotes also made the price increases more noticeable. LEDinside furthermore expects the material and manufacturing costs will play a central role in the pricing among industry players.
According to LEDinside’s analysis, another surge in the costs of raw materials is driving the current price upturn in the LED chip market. There had been increases in prices of copper, gold wire, aluminum and PCB substrates through 2016. This latest wave was triggered by the result of the U.S. presidential election. Raw material markets are being lifted by the anticipation that the incoming administration will launch major infrastructure programs. Additionally, the recent sharp depreciation of China’s currency has also indirectly pushed up material costs for LED chip makers.
Despite the price hike announcement by San’an Opto’s, most LED chip makers have yet to follow suit as they will wait and observe the follow-up development in the market. With costs increasing, LEDinside expects some small- and medium-sized LED manufacturers will become too uncompetitive to stay in the market. Product orders instead will gradually concentrate on the major manufacturers. The consolidation process of the LED industry therefore will also become more apparent later on.
Suggested Items
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?