Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?

05/06/2024 | IDTechEx
Future connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.

Electronics Industry Sentiment Rose in April, Hitting New High

05/02/2024 | IPC
April 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.

LQDX Divests Aluminum Soldering Business - Mina™ - to Taiyo America Inc.

05/02/2024 | PRNewswire
LQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has divested its aluminum soldering business – known as MinaTM – to Taiyo America Inc., a global market leader in advanced electronic materials.

Worldwide Silicon Wafer Shipments Dip 5% in Q1 2024

05/01/2024 | SEMI
Worldwide silicon wafer shipments decreased 5.4% quarter-over-quarter to 2,834 million square inches in the first quarter of 2024, a 13.2% drop from the 3,265 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.

Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications

04/30/2024 | Indium Corporation
Indium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in