Viettel, Qualcomm to Collaborate on 5G Infrastructure Development
May 16, 2022 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
Viettel Group and Qualcomm Technologies, Inc. announced plans to collaborate and develop a next-generation 5G Radio Unit (RU) with massive MIMO capabilities and distributed units (DUs). This focuses on helping to fast track the development and roll out of 5G network infrastructure and services in Vietnam and globally.
Using the Qualcomm® X100 5G RAN Accelerator Card and Massive MIMO Qualcomm® QRU100 5G RAN Platform combined with Viettel High Technology’s advanced hardware and software systems will help Viettel to accelerate the development and commercialization of high-performance Open RAN massive MIMO solutions, simplify network deployment and lower total cost of ownership (TCO).
Combining Viettel’s telecommunications infrastructure development expertise with Qualcomm Technologies’ technology leadership in developing high performance and low power Application-Specific Integrated Circuit (ASIC) 5G solutions for device and infrastructure products will advance the cellular ecosystem and accelerating the innovation cycle.
“Viettel has been a pioneer in adopting new telecommunications technologies including 5G. We are delighted to have Qualcomm Technologies as a key technology provider in our 5G gNodeB project,” said Nguyen Vu Ha, general director, Viettel High Technology. “This collaboration between Qualcomm Technologies and Viettel Group will be the cornerstone of Vietnam’s national strategy for Made in Vietnam 5G infrastructure.”
“Qualcomm Technologies, as a global technology leader in 5G, is looking forward to collaborating with Viettel for the development of Open RAN solutions that will establish the foundation for Vietnam’s next-generation of wireless networks,” said Durga Malladi, senior vice president and general manager, Cellular Modems and Infrastructure, Qualcomm Technologies, Inc. “This collaboration will demonstrate the scalability of Qualcomm Technologies’ horizontal platform for vertical integration in the ORAN infrastructure ecosystem and we are pleased to offer high performance, power efficient Modem-RF technology that supports the performance demands needed to bring rapid speeds and expanded use cases of 5G networks to consumers.”
“As the need for reliable, robust, and powerful mobile experiences increases across Vietnam, we anticipate a new wave of demand for 5G services from both end users and enterprises. Joining forces with Viettel will allow us to innovate through and launch technology that will advance the cellular ecosystem and accelerate the enablement and deployment of modern networks at scale,” said ST Liew, vice president, QUALCOMM CDMA Technologies Asia-Pacific Pte. Ltd. and president, Qualcomm Taiwan and South East Asia. “We look forward to working closely with Viettel for the rollout of advanced 5G infrastructure and services for Vietnam and globally.”
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).