NextFlex Launches $4.4M Hybrid Electronics Funding Opportunity
March 22, 2023 | Business WireEstimated reading time: 1 minute
NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, released Project Call 8.0 (PC 8.0), the latest call for proposals that seek to fund projects that further the development and adoption of FHE while addressing key challenges in advanced manufacturing that support Department of Defense priorities. The total PC 8.0 project value is expected to exceed $9.4M (project value/investment figures include cost-sharing), bringing the total anticipated investment in advancing FHE since NextFlex’s formation to $134M.
Building from the success and maturity of past Project Calls, PC 8.0 continues the use of broadly defined topics to enable a diverse proposer base, with special emphasis on areas in which FHE can impact high priority U.S. manufacturing opportunities and areas of emerging importance within the FHE community. Areas of emphasis include FHE-enabled manufacturing for applications in additive packaging, high performance interconnects, applications in harsh environments including space, and reducing environmental and climate impacts of electronics manufacturing with FHE approaches.
"This new funding opportunity carries the momentum from previous project calls to elevate the level of sophistication of FHE-enabled devices, extend hybrid electronic manufacturing process capability, and enhance environmental sustainability," said Scott Miller, NextFlex Director of Technology. "As FHE technology’s potential has been more fully demonstrated, we are now able to focus on meeting the reliability, standardization, and advancing technology transition into the U.S. industrial manufacturing base."
All project proposals for PC 8.0 should include elements to advance technology transitions while maintaining focusing on manufacturing challenges in these topic areas:
- Additively Manufactured 3D Devices with Increased Complexity
- High Performance FHE Interconnects
- Harsh Environment Hybrid Electronic Components with Proven Reliability
- Advancing the Manufacturability of FHE Processes Towards Standardization
- Environmentally Sustainable FHE Manufacturing, Design Strategies, and Use-Cases
- Open Topic for "New Project Leads"
In addition, NextFlex announces the release of its latest FHE Technology Roadmaps. Developed by subject matter experts from industry, academia and government, the NextFlex Technical Working Groups in 11 technical areas of emphasis – Automotive; Device Integration & Packaging; Materials; Modeling & Design; Printed Components & Microfluidics; Standards, Test & Reliability; Asset Monitoring Systems; Flexible Power; Human Monitoring Systems; Integrated Antenna Arrays; and Soft Wearable Robotics – update the roadmaps each year. The roadmaps contain detailed information on the current state of the art, market opportunities and needs, key stakeholders, a five-year forward-looking development roadmap, and prioritized technical gaps identified by each Technical Working Group. These roadmaps inform the priorities for NextFlex Project Calls.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Custom PCB Solutions With Adura
05/20/2024 | Real Time with...IPC APEX EXPOColumnist Dan Beaulieu and Sumit Tomar, CEO of Adura, discuss the company's comprehensive manufacturing of custom PCBs. The company excels in thermal PCB technology for enhanced conductivity. As Sumit explains, they also plan to venture into power management, leveraging their U.S.-based manufacturing capabilities.
Zentech First to Adopt IPC Apprenticeship National Program Standards
05/20/2024 | Cory Blaylock, IPCIPC achieved a landmark in 2023 by creating an apprenticeship program approved by the U.S. Department of Labor. With such a registered framework in place, industry can work through IPC to secure local, state, and federal dollars for workforce development in a way they’ve never been able to do before. Zentech Manufacturing, headquartered in Baltimore, Maryland, with production facilities in Bloomington, Illinois, and Richardson, Texas, is the first employer partner to adopt IPC’s national program. Click here to read their story.
Danutek Celebrates 20 Anniversary
05/20/2024 | DanutekDanutek, a leading supplier of capital equipment and service support to the electronics manufacturing sector in Europe, proudly marks its 20th anniversary this year.
GlobalFoundries Appoints KC Ang as President of Asia
05/20/2024 | GlobalFoundriesGlobalFoundries (GF) announced the appointment of industry and company veteran, Kay Chai (KC) Ang, as President of Asia and Chairman of China.
Additive Manufacturing: PCB007 Magazine May 2024 Issue
05/20/2024 | I-Connect007 Editorial TeamThough modern semi-additive and fully additive technologies are still emerging for PCB manufacturing, additive technology itself is not new. In this month’s issue, we explore additive manufacturing technology for the PCB fabricator: where it stands today, the true benefits, and where it seems to be headed.