Siemens, IBM Collaborate to Accelerate Sustainable Product Development and Operations
April 18, 2023 | SiemensEstimated reading time: 3 minutes
Siemens Digital Industries Software and IBM announced they are expanding their long-term partnership by collaborating to develop a combined software solution integrating their respective offerings for systems engineering, service lifecycle management and asset management.
Increasing competitive pressures, tight labor markets and growing environmental compliance objectives require organizations to adopt a more holistic management approach that spans the product and asset lifecycle. The companies will develop a combined software solution to help organizations optimize product lifecycles, and make it easier to improve traceability across processes, prototype and test concepts much earlier in development, and adopt more sustainable product designs. The goal is to help organizations speed innovation and time to market which can lead to improved quality and lowered costs.
The new combined SysML v1 standards-based suite of integrated engineering software is expected to support traceability and sustainable product development using a digital thread that links mechanical, electronics, electrical engineering and software design and implementation. It is intended to span the product lifecycle, from early design and manufacturing to operations, maintenance, update and end of life management. Initially, the companies are working to connectIBM Engineering System Design Rhapsodyfor systems engineering with solutions from the Siemens Xcelerator portfolio of software and services including Siemens’ Teamcenter® softwarefor Product Lifecycle Management (PLM) and Capital™ softwarefor electrical/electronic (E/E) systems development and software implementation. The companies have also connected the IBM Maximo Application Suitefor asset management with Siemens’ Teamcenter software to support an integrated digital thread between service engineering, asset management and services execution.
These integrations will focus on the effective reuse of processes and materials to allow traceability for sustainable product development. This can help companies to make informed decisions earlier in the design and engineering process to help drive improvements in cost, performance and sustainability. For example, companies can more quickly identify under-performing components or design elements that consume excessive amounts of power, or require maintenance or early replacement, and product innovation can be driven through an integrated digital thread that connects the physical and software assets back into product development.
“A significant portion of product innovation and differentiation contains electrical, electronics and software components. Yet, manufacturing companies are struggling to bring new products to market on time, as the current tools, processes, and information to manage these components are siloed and disconnected,” said Kareem Yusuf Ph.D, Senior Vice President, Product Management and Growth, IBM Software. “To address this gap, IBM and Siemens are collaborating on a digital thread environment to integrate sustainability practices throughout the lifecycle of a product, from design, production, operation, maintenance and beyond. This connectivity will help enable quicker time to innovation and compliance preparedness, and overall improved product quality.”
Siemens and IBM are also collaborating to create a SysML v2 based solution with a migration path to help customers transition to next generation systems engineering. SysML supports the specification, analysis, design, verification and validation of a broad range of systems and systems-of-systems. Service lifecycle management can assist in maximizing business value for product servitization by connecting service engineering to service maintenance to facilitate new collaborative processes between OEM and operators.
“Together, Siemens and IBM will deliver a simulation-driven systems and software engineering solution that is designed to cover the full operational lifecycle. This can empower our customers to innovate by helping to reduce product development costs, drive continuous improvement and create operational efficiencies across the extended enterprise throughout the product’s operation lifecycle,” said Tony Hemmelgarn, President and Chief Executive Officer, Siemens Digital Industries Software. “We are developing this to help companies truly shift left by improving extensibility and reuse of systems models and associated data with standards-based solutions in an open ecosystem and to enable our customers to develop better products.”
Kamil Mrva, Chief Information Officer at ŠKODA Group and early adopter of the service lifecycle and asset management solution, said: “We are working very closely together with Siemens and IBM to help us to reach our sustainability goals, reduce total cost of ownership (TCO) of products for our customers and support our business transformation with an increased focus on services.”
Siemens will be supported by benefits through IBM's newly launched Partner Plus program and will offer the solution as part of the Siemens Xcelerator ecosystem.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.