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3D Electronic Devices With Additive Manufacturing

11/29/2022 | Shavi Spinzi, Nano Dimension
Imagine fabricating PCBs without the hassle of drilled vias and metal plating. Imagine PCBs with near-perfect registration. If we take it to the next stage, imagine drawing electronics in 3D space. There is a way to do all this with additively manufactured electronics (AME). We just need to start to think in 3D. This will allow us to abandon the 2D limitations that we have become so used to and expand our horizons so that we can climb to higher levels of performance. In this article, I will explore the two fundamental capabilities that are the cornerstones for drawing electronics in 3D space, which is where AME technology and 3D design capabilities converge.

Does Copper Pour on a Signal Layer Decrease Signal-To-Signal Isolation?

04/07/2022 | Steve Hageman, Analog Home
Does putting a ground pour on PCB signal layers make the isolation better or worse? It can go either way, but with the proper knowledge and application, this technique will improve your designs. In this article, I’ll discuss how to simulate trace-to-trace isolation with true electromagnetic simulation software. We’ll also cover a variety of rules of thumb that can help you stay away from trouble.

Gardien Group Now offers Insulation (IR) Testing and Micro-Short Detection

01/14/2022 | Gardien Group
As part of Gardien’s growing list of options for quality control in the printed circuit boards industry, we now offer Insulation Testing and Micro-Short detection on our Flying Probe lines running the Gardien FPX software.

Flying Probe Testing vs IPC-9252B

05/30/2017 | Todd Kolmodin -- Column: Testing Todd
Flying probe testing is extremely popular in today’s manufacturing theatres. The main factor is cost reduction in contrast to dedicated fixtures and fixture testing. However, there are some limitations in flying probe testing when gauged against industry specifications—specifically, the use of indirect vs direct testing in Test Level C.

Achieving Near-Perfect Optical Isolation Using Opto-Mechanical Transparency

05/10/2017 | University of Illinois at Urbana-Champaign
Researchers from the University of Illinois at Urbana-Champaign have demonstrated a new level of optical isolation necessary to advance on-chip optical signal processing. The technique involving light-sound interaction can be implemented in nearly any photonic foundry process and can significantly impact optical computing and communication systems.
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