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Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU

05/03/2024 | PRNewswire
Synopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.

Keysight Secures New Test Case Validations for Narrowband Non-Terrestrial Networks Standard

04/30/2024 | Keysight Technologies
Keysight Technologies, Inc. has validated new conformance test cases for 3rd Generation Partnership Project (3GPP) Release 17 (Rel-17) standards for non-terrestrial networks (NTN) using narrowband internet of things (NB-IoT) technology.

Mobileye EyeQ6 Lite Launches to Speed ADAS Upgrades Worldwide

04/17/2024 | BUSINESS WIRE
Mobileye announced it has delivered the first production-candidate hardware and software of its new EyeQ™6 Lite system-on-chip to its customers, which will power advanced driver-assistance systems in multiple models launching this year.

AST SpaceMobile ASIC Chip Enters Tape-Out Phase in Collaboration with TSMC

03/28/2024 | BUSINESS WIRE
AST SpaceMobile, Inc., the company building the first and only space-based cellular broadband network accessible directly by everyday smartphones designed for both commercial and government use, proudly announces the commencement of the tape-out phase for its Application-Specific Integrated Circuit (ASIC), in collaboration with TSMC, the world's leading foundry.

Qualcomm Brings the Best of On-Device AI to More Smartphones with Snapdragon 8s Gen 3

03/18/2024 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced the Snapdragon® 8s Gen 3 Mobile Platform, delivering the most sought-after 8 series capabilities to more Android flagship smartphones, for extraordinary, premium experiences.
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