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Snapdragon Powers Samsung’s New Galaxy Lineup Globally

07/27/2023 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced that its flagship Snapdragon® 8 Gen 2 Mobile Platform for Galaxy is powering Samsung Electronics Co., Ltd.’s new cutting-edge foldable smartphones, the Samsung Galaxy Z Fold5 and Galaxy Z Flip5, and its latest Galaxy Tab S9 Series.

Flip Electronics Acquires Resurgent Semiconductor

02/21/2023 | Business Wire
O2 Investment Partners is pleased to announce that Flip Electronics, an authorized specialty distributor of obsolete electronic components to customers across the U.S. and internationally, has acquired Resurgent Semiconductor.

Indium Introduces New Ultra-Low Residue Flip-Chip Flux at ECTC

05/31/2022 | Indium Corporation
Indium Corporation will introduce NC-809, a new halogen-free, ultra-low residue, flip-chip flux at the Electronic Components and Technology Conference (ECTC), May 31-June 3, San Diego, California, U.S.

iNEMI's End-of-Project Webinar: 1st Level Interconnect Void Characterization Project, Phase 2

05/23/2022 | iNEMI
Phase 2 of the 1st Level Interconnect Void Characterization project focused on understanding the potentially adverse impact that voids in first level interconnect materials have on the reliability of the electrical interconnect.

Flexible Thinking: Star Trek Memories

06/15/2021 | Joe Fjelstad -- Column: Flexible Thinking
Columnist Joe Fjelstad not only watched Star Trek with fascination, he grew to become his own inventor, thanks to his father—an aerospace engineer. "The passion for flight, especially rocketry, entered my veins early," he writes.
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