Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

TSMC Celebrates 30th North America Technology Symposium

04/29/2024 | TSMC
TSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.

Guerrilla RF Completes Strategic Acquisition of GaN Device Portfolio from Gallium Semiconductor

04/29/2024 | BUSINESS WIRE
Guerrilla RF, Inc. has finalized the acquisition of Gallium Semiconductor's entire portfolio of GaN power amplifiers and front-end modules. Effective April 26th, 2024, GUER acquired all previously released components as well as new cores under development at Gallium Semiconductor.

ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

04/23/2024 | ROHM
ROHM and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.

Revolutionizing Sustainable Energy: Georgia Solar Companies Partner with Georgia Power to Unveil New Parking Deck Solar Array

04/19/2024 | BUSINESS WIRE
Three Georgia-based solar companies have joined together to design, build and construct an innovative solar array atop the parking deck at Georgia Power’s headquarters in Atlanta, Georgia.

Intel Brings AI-Platform Innovation to Life at the Olympic Games

04/18/2024 | BUSINESS WIRE
Intel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in