It’s Only Common Sense: Nice Guys Really Can Finish First
The Right Approach: I Hear the Train A Comin'
Marcy's Musings: The Growing IndustryNow Available: Episode 4, Season 2 of Designing for Reality—Lamination
April 4, 2024 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 has just released the latest episode of its podcast series, On the Line With..., which focuses on designing for reality in the electronics industry. Multilayer boards bring along a completely different set of processes. In this installment, ASC Sunstone VP/Manager Matt Stevenson discusses manufacturing techniques for multilayer boards. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.
This season is all about the specifics that can affect your circuit board during the manufacturing process and includes tips and tricks for optimizing design, fabrication, yields, and cost. The series is suitable for all skill levels and aims to provide valuable insights into the industry.
I-Connect007 is committed to providing digital content that meets the needs of the electronics industry, including magazines, books, newsletters, market reports, podcasts, and event coverage. As the industry's longest-running digital media company, I-Connect007 is a leading publisher of exclusive content for the global electronics industry.
Visit our educational resource center to access more free content.
Share on:
Suggested Items
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
On the Line With... Podcast Talks With Cadence Expert on Manufacturing
04/18/2024 | I-Connect007In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
I-Connect007 Adds to Technical Library With Book on Factory Analytics by Cogiscan
04/03/2024 | I-Connect007I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Factory Analytics: Unlocking Efficiency Through Data Insights. Thirty-eighth in a series of educational technical books published by I-Connect007, this book is a guide to understanding how analyzing your factory data is the key to competitive advantage for your factory.
MacDermid Alpha Electronics Solutions’ New Book Now Available for Download
03/29/2024 | I-Connect007I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth Turner at MAES. The latest in a series of educational books published by I-Connect007, this book is an introductory guide to understanding encapsulation resins and a tool for application troubleshooting.