Imec Advances 200mm GaN-on-Si Technology Closer to Manufacturing
December 15, 2015 | ImecEstimated reading time: 2 minutes
At IEEE International Electron Devices Meeting 2015, world-leading nano-electronics research center imec presented three novel aluminum gallium nitride (AlGaN)/ gallium nitride (GaN) stacks featuring optimized low dispersion buffer designs. Moreover, imec optimized the epitaxial p-GaN growth process on 200mm silicon wafers, achieving e-mode devices featuring beyond state-of-the-art high threshold voltage (Vt) and high drive current (Id).
To achieve a good, current-collapse-free device operation in AlGaN/GaN-on-Silicon (Si) devices, dispersion must be kept to a minimum. Trapped charges in the buffer between the GaN-based channel and the silicon substrate are known to be a critical factor in causing dispersion. Imec compared the impact of different types of buffers on dispersion and optimized three types: a classic step-graded buffer, a buffer with low-temperature AlN interlayers, and a super lattice buffer. These three types of buffers were optimized for low dispersion, leakage and breakdown voltage over a wide temperature range and bias conditions.
Imec also optimized the epitaxial p-GaN growth process demonstrating improved electrical performance of p-GaN HEMTs, achieving a beyond state-of-the-art combination of high threshold voltage, low on-resistance and high drive current (Vt >2V, RON= 7 Ω.mm and Id >0.4A/mm at 10V). The P-GaN HEMT results outperformed their MISHEMT counterparts.
Imec’s GaN-on-Si R&D program aims at bringing this technology towards industrialization. Imec’s offering includes a complete 200mm CMOS-compatible 200V GaN process line that features excellent specs on e-mode devices. Imec’s program allows partners early access to next-generation devices and power electronics processes, equipment and technologies, and speed up innovation at shared costs. Current R&D focuses on improving the performance and reliability of imec’s e-mode devices, while in parallel pushing the boundaries of the technology through innovation in substrate technology, higher levels of integration and exploration of novel device architectures.
“Imec’s presentations at the renowned IEDM meeting last week are a testament to the capabilities, sophistication, and maturity of our 200mm GaN-on-Silicon platform,” stated Rudi Cartuyvels, executive vice president of smart systems and energy technology at imec. “Building upon this success, we are now working with our GaN partners to implement and transfer specific device customizations. in parallel, we are exploring alternative substrate technologies to further push the boundaries of the GaN technology.”
About imec
Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, USA, China, India and Japan. Its staff of about 2,300 people includes almost 700 industrial residents and guest researchers. In 2014, imec's revenue (P&L) totaled 363 million euro.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).