Page 2 of 2

Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND

04/29/2024 | Samsung Electronics
Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.

TSMC Celebrates 30th North America Technology Symposium

04/29/2024 | TSMC
TSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.

QinetiQ Achieves UK’s First Jet-to-Jet Teaming Between Aircraft and Autonomous Drone

04/29/2024 | QinetiQ
QinetiQ has successfully trialled the UK’s first Crewed-Uncrewed-Teaming demonstration between a crewed aircraft and an autonomous jet drone.

Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics

04/26/2024 | IDTechEx
Flexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.

iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging

04/26/2024 | iNEMI
Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in