Cooling Graphene-based Film Close to Pilot-scale Production
April 29, 2016 | CHALMERS UNIVERSITY OF TECHNOLOGYEstimated reading time: 1 minute
Heat dissipation in electronics and optoelectronics is a severe bottleneck in the further development of systems in these fields. To come to grips with this serious issue, researchers at Chalmers University of Technology have developed an efficient way of cooling electronics by using functionalized graphene nanoflakes. The results will be published in the renowned journal Nature Communications.
"Essentially, we have found a golden key with which to achieve efficient heat transport in electronics and other power devices by using graphene nanoflake-based film. This can open up potential uses of this kind of film in broad areas, and we are getting closer to pilot-scale production based on this discovery," says Johan Liu, Professor of Electronics Production at Chalmers University of Technology in Sweden.
The researchers studied the heat transfer enhancement of the film with different functionalized amino-based and azide-based silane molecules, and found that the heat transfer efficiency of the film can be improved by over 76 percent by introducing functionalization molecules, compared to a reference system without the functional layer. This is mainly because the contact resistance was drastically reduced by introducing the functionalization molecules.
Meanwhile, molecular dynamic simulations and ab initio calculations reveal that the functional layer constrains the cross-plane scattering of low-frequency phonons, which in turn enhances in-plane heat-conduction of the bonded film by recovering the long flexural phonon lifetime. The results suggested potential thermal management solutions for electronic devices.
In the research, scientists studied a number of molecules that were immobilized at the interfaces and at the edge of graphene nanoflake-based sheets forming covalent bonds. They also probed interface thermal resistance by using a photo-thermal reflectance measurement technique to demonstrate an improved thermal coupling due to functionalization.
"This is the first time that such systematic research has been done. The present work is much more extensive than previously published results from several involved partners, and it covers more functionalization molecules and also more extensive direct evidence of the thermal contact resistance measurement," says Johan Liu.
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.