How Repeated Spot Microdischarges Damage Microdevices
May 19, 2016 | SpringerEstimated reading time: 1 minute
In microelectronics, devices made up of two electrodes separated by an insulating barrier are subject to multiple of microdischarges - referred to as microfilaments - at the same spot. These stem from residual excited atoms and ions from within the material, the surface charge deposited on the insulating part of the device, and local temperature build-up. These reoccurences can lead to the creation of pin-holes in the material of the microelectronic devices where they occur, and are due to local reductions in the electric field. Now, Jozef Ráhel and colleagues from Masaryk University in the Czech Republic have elucidated the mechanism of microdischarge reoccurrence, by attributing it to the temperature increase in a single microdischarge. These results were recently published in EPJ D.
The authors evaluated the effect of a local temperature increase on the stabilisation on such a microelectronic devices, via multiple microdischarges. Interestingly, the temperature increase is virtually independent of chemical changes occurring within the microdischarge. Therefore, it can provide information on the fundamental minimum triggering the mechanism of such discharges. The authors evaluated the influence of the temperature in a series of microdischarges by measuring the local breakdown voltage, at regular atmospheric pressure. By doing so, they effectively ruled out the possible influence of the residual plasma on the microdischarge effect.
They found that the temperature increase in a single microdischarge reduces the electric field within the device. In turn, this can cause preferential subsequent breakdown in the location where the previous discharge occurred.
In parallel, they developed a numerical model for residual heat build-up, using their experimental results as a basis. The model was used to gain better insights into the role played by the nearby insulating wall. Their results suggest that considering a quasi-stable background gas temperature could prove helpful when modelling chemical processes within the microdischarge in such devices.
Suggested Items
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
The Chemical Connection: Reducing Etch System Water Usage, Part 1
04/05/2024 | Don Ball -- Column: The Chemical ConnectionWater conservation has become an important component of the overall system design for most manufacturing operations today. Changing climate conditions and increasing populations are beginning to strain the freshwater supplies in many areas of the country. As a result, as equipment suppliers, we see an increasing number of requests for options that reduce water usage in proposed wet processing systems. Etching systems tend to use more water because of the need for close temperature control to maintain steady etch rates and the rinsing requirements for complete removal of corrosive etchants from the surface of the product before the next process step. This column contains some simple suggestions for reducing water usage in etch systems that won’t strain the budget too much.
Indium’s Sze Pei Lim to Present on Semiconductor Packaging at ICEP Japan
04/02/2024 | Indium CorporationIndium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP 2024).
Nihon Superior Sets New Standards in Lead-Free Soldering Technology at APEX 2024
03/13/2024 | PVANihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China
02/28/2024 | Indium CorporationAs a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.