Global Smart Textiles for Wearable Technology Market Trends Analysis and Forecasts to 2021
June 14, 2016 | Business WireEstimated reading time: 1 minute
Research and Markets has announced the addition of the "Global Smart Textiles for Wearable Technology Market: Trends Analysis and Forecast to 2021"report to their offering.
Globally the smart textile for wearable technology market is growing at a rapid pace, the author predicts the smart technology market to grow at a CAGR more than 30% by 2021.
Globally, the smart textiles were manufactured using woven or knitting technologies, however with the advancements in the printed electronics conductive inks can be printed on textiles. Dupont has invented conductive inks that can be printed on the textiles and can be used for longer period of time.
Smart textiles include conductive materials such as silver, copper, nickel. The smart fibers are manufactured by using yarn with woven or knitted interactive materials, which can interact with the environment or the user. Such textiles are also referred to as e-textiles. Smart fabric is a traditional fabric with added interactive functionality such as power generation or storage, sensing, radio frequency functioning, human interface elements and/or assistive technology.
Currently, the global smart textiles for wearable technology market is expected to grow at rapid pace. The growth in this market can be acknowledged to the drivers such as growing wearable electronics market, growing popularity of smart gadgets with advanced features, and growing demand for low cost smart sensors.
However, the growth in this market is expected to be restrained by high cost of production of smart textiles and compatibility issues. As per the study a majority of the revenue in the global smart textiles for wearable technology comes from its military and safety applications followed by home and architectural applications. Among the geographies Europe dominated the market in 2015 followed by North America. Asia Pacific region is expected to grow at the highest CAGR over the forecast period.
Suggested Items
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?