Highly Automated Driving to Spark Adoption of Centralized Advanced Driver Assistance Systems
August 17, 2016 | ABI ResearchEstimated reading time: 1 minute
As vehicles become highly independent and begin to drive and react to traffic on their own, autonomous systems will aggregate and process data from a variety of on-board sensors and connected infrastructure. This forces the industry to hit a hard reset on advanced driver assistance systems (ADAS) architectures, currently dominated by distributed processing and smart sensors. Automotive OEMs will need to adopt new platforms based on powerful, centralized processors and high-speed low latency networking. ABI Research forecasts 13 million vehicles with centralized ADAS platforms will ship in 2025.
“The distributed approach to ADAS systems will prove unsustainable as OEMs look to deliver highly automated driving around 2020,” says James Hodgson, Industry Analyst at ABI Research. “The new centralized ADAS architectures will unify sensing, processing, and actuation to deliver integrated decision-making for smooth path planning and effective collision avoidance.”
This transition will present major opportunities for vendors new to the industry, as well as old incumbents, including NVIDIA, NXP, and Mobileye, who all announced centralized autonomous driving platforms. While each is in a different stage of development, all have common themes emerging, particularly in relation to processing power. The platforms average between eight and twelve teraflops (TFLOPs)—a figure that is orders of magnitude beyond the typical smart sensor currently deployed in ADAS.
Physical separation of numerous dumb sensors and centralized processing will also open up opportunities for in-vehicle networking vendors. Ethernet-based solutions from vendors such as Marvell Semiconductor and Valens Semiconductor are well-positioned to meet the needs of high bandwidth and stringent automotive-grade requirements at a low cost.
“We are fast approaching the end of what can be achieved in automation within the confines of legacy architectures,” concludes Hodgson. “While there are not yet any specific standards for centralized ADAS, it is interesting that three separate Tier 2s announced very similar platforms in quick succession. Vendors across the ecosystem need to take this time to plan accordingly in order to appropriately manage the industry transition toward centralized ADAS architectures.”
Suggested Items
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
The New Industry: Will the Growth Continue?
04/30/2024 | I-Connect007 Editorial TeamHow sustainable are the primary financial models in the United States regarding PCB fabrication shops? In this interview with economic experts Shawn DuBravac and Tom Kastner, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.
TTM’s High Tech Expansion and Industry Innovation
04/30/2024 | Marcy LaRont, PCB007 MagazineTom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.
U.S. Companies Invest Heavily in Robots
04/30/2024 | IFRManufacturing companies in the United States have invested heavily in more automation: total installations of industrial robots rose by 12% and reached 44,303 units in 2023. Number one adopter is the car industry followed by the electrical and electronics sector.
USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.