OLED Microdisplays in Data Glasses for Improved Human-Machine Interaction
September 20, 2016 | Fraunhofer-GesellschaftEstimated reading time: 2 minutes
The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP has been developing various applications for OLED microdisplays based on organic semiconductors. By integrating the capabilities of an image sensor directly into the microdisplay, eye movements can be recorded by the smart glasses and utilized for guidance and control functions, as one example. The new design will be debuted at Augmented World Expo Europe (AWE) in Berlin at Booth B29, October 18th – 19th.
“Augmented-reality” and “wearables” have become terms we encounter almost daily. Both can make daily life a little simpler and provide valuable assistance for patients, athletes, and in manufacturing. With the help of the so-called bi-directional OLED microdisplays, which are developed by Fraunhofer FEP, the function of “wearable displays” and hands-free eye controlled systems are joined together in a unique way.
“Eye-controlled augmented-reality smart glasses using our OLED microdisplays can be designed to be relatively small and light-weight since the display and image sensor are integrated on a single chip. A new and improved development platform is now available to our clients for creating proprietary products”, explains Judith Baumgarten, Project Manager at Fraunhofer FEP.
The current generation of color bi-directional microdisplays offers SVGA resolution (800 × 600 × RGBW) and for the first time sufficient image quality to become established in this market segment. The updated hardware design with standard HDMI and USB interfaces likewise contribute to getting established.
The eyeglasses exhibited at AWE Europe 2016 originated within the FAIR Project completed this year, was funded by the German Federal Ministry of Education and Research (BMBF). The project objective was to develop smart glasses for human-machine interaction, with control based on visual information captured and derived from eye movements.
The bi-directional full color OLED microdisplays integrated into see-trough data eye-glasses under this joint project were designed by project partner Trivisio, who developed a specialized mechanical design to fit the head in order to achieve good comfort and wearability. The electronics were integrated completely into the glasses so that they can be connected to a PC without an intermediate controller.
Where can these types of smart glasses become beneficially employed?
Various use-cases were examined and suitable application software for guide-by-eye control were developed by project partners Interactive Minds and Mecotec. One application developed is a communications and entertainment platform for ALS patients. It converts pre-composed text segments as well as those created by the patients themselves into audible speech signals, as well as enabling photographs to be selected and displayed, and videos and music to be watched and listened to.
Another application was developed for industry. In this case the glasses were used for calibration of pressure regulators in production facilities. Technical University Dresden monitored the project both with respect to the ALS patients (through the university’s Klinik und Poliklinik für Neurologie (hospital and ambulatory neurology)), as well as carrying out studies on ergonometry and user-friendly design (via the Chair for Industrial Psychology and Applied Cognition Research).
Besides these application examples, the advanced bi-directional OLED microdisplays of Fraunhofer FEP open up a whole world of possibilities and opportunities. The displays can be acquired in various evaluation kits for industry partners to test out their own ideas. This facilitates the integration of the displays in client-specific applications, and our scientists look forward to new research and development projects.
Suggested Items
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
North American PCB Industry Sales Down 23.8% in March
04/29/2024 | IPCIPC announced the March 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.13.
Rogers Corporation Reports Q1 2024 Results
04/26/2024 | Rogers CorporationNet sales of $213.4 million increased 4.3% versus the prior quarter resulting from higher sales in the AES and EMS business units. AES net sales increased by 4.1% primarily related to higher aerospace and defense (A&D), wireless infrastructure, industrial and renewable energy sales, partially offset by lower EV/HEV and ADAS sales. EMS net sales increased by 2.8% primarily from higher general industrial, A&D and EV/HEV sales, partially offset by seasonally lower portable electronics sales.
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
What’s Next Becomes Now at IPC APEX EXPO 2024
04/22/2024 | IPCFrom revolutionary advancements in artificial intelligence, augmented reality and the latest innovations in capital equipment on the show floor to a heightened learner experience through the 16th Electronic Circuits World Convention (ECWC16) technical conference, IPC APEX EXPO 2024 provided education, professional development and numerous networking opportunities, for 3,723 attendees from 57 countries.