Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Happy’s Tech Talk #27: Integrated Mesh Power System (IMPS) for PCBs

04/08/2024 | Happy Holden -- Column: Happy’s Tech Talk
A significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12, and more to only two layers. Besides reducing direct processing steps, the yield will increase as defect-producing operations are eliminated. The integrated mesh power system (IMPS) was invented in the latter years of MCM-D use for thin-film fabrication. Those geometries fit today into our use of ultra HDI.

Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO

04/03/2024 | Insulectro
Insulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.

Now Available: Episode 4, Season 2 of Designing for Reality—Lamination

04/04/2024 | I-Connect007
I-Connect007 has just released the latest episode of its podcast series, On the Line With..., which focuses on designing for reality in the electronics industry. Multilayer boards bring along a completely different set of processes. In this installment, ASC Sunstone VP/Manager Matt Stevenson discusses manufacturing techniques for multilayer boards. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.

Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1

04/01/2024 | Yash Sutariya, Saturn Electronics Services
They call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.

Kioxia, WD Elevate Capacity Utilization, Pushing NAND Flash Supply Growth to 10.9%

03/19/2024 | TrendForce
TrendForce reports that anticipation of NAND Flash price hikes into Q2 has motivated certain suppliers to minimize losses and lower costs in hopes of returning to profitability this year.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in