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Orbotech Ltd., today announced that SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, has been named by imec, a world-leading nano-electronics research center, as a new supplier of physical vapor deposition (PVD) solutions for under bump metallization (UBM) and redistribution layer (RDL) processes for next generation fan-out packaging technologies. Imec has selected SPTS’s Sigma fxP PVD solution as the new process tool of record (PTOR) for low temperature PVD for development of novel fan-out technologies such as flexible micro-bumps for chip scale packaging.
“To meet the technical requirements of future micro- and nano-electronics, novel 3D integrated circuit (IC) architectures need to be developed to meet scaling challenges without compromising cost, performance, and power budgets,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. “Imec works closely with leading semiconductor companies to develop innovative wafer-level packaging architectures that will meet the performance requirements of next generation devices such as application processors that drive virtual reality applications or enable high performance computing for artificial intelligence. We are proud that imec selected SPTS’ Sigma for its 3D System Integration Program, reflecting our PVD solutions’ excellent results, particularly in low temperature RDL and copper pillar creation on low temperature tolerant polymers. We look forward to working with imec and its partners in developing innovative interconnect and fan-out technologies.”
Mr Crofton added,” SPTS specializes in UBM/RDL PVD for Flip Chip and fan-out applications, and our low temperature PVD capabilities will support the development of a range of new interconnect technologies at imec, including flexi bumps, to address the scaling and packaging needs of future generations of nano-electronics.”
Dr Anthony Barker, PVD Product Manager at SPTS, will be giving an invited talk titled: “Fantastic Fan-out; Improving Interconnect Productivity for the Fastest Growing Packaging Platform” on Thursday 13 July, 14.00 – 14.30 at the Advanced Packaging Meet the Expert Session, at SEMICON West, in San Francisco.
To learn more about SPTS’s Sigma fxP PVD solutions, and full range of industry leading etch, deposition, and inkjet solutions for advanced packaging applications visit SPTS Technologies on Booth No.7617 in West Hall at SEMICON West, 11 – 13 July, Moscone Center, San Francisco.
About Sigma fxP PVD
The Sigma fxP is a cluster PVD system used by device manufacturers in various end markets including power management, MEMS and RF devices. In semiconductor packaging, the Sigma fxP deposits RDL and under bump metals (UBM) for Cu micropillar and TSV’s, plus TSV liner/barrier for 3DWLP. For FOWLP, the system carries a Multi Wafer Degas (MWD) for low temperature, high productivity degas of epoxy mold compound. Its SE-LTX etch module pre-cleans organic films with twice the mean wafers between cleans (MWBC) compared to competing systems.
About Orbotech Ltd.
Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices, designed to enable the production of innovative, next generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech’s core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality, pattern the desired electronic circuitry on the relevant substrate and perform three-dimensional shaping of metalized circuits on multiple surfaces, and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing. For further information, visit http://www.orbotech.com and www.spts.com.