IWLPC Program Announced and Registration Now Open
July 19, 2017 | IWLPCEstimated reading time: 1 minute
The SMTA and Chip Scale Review have announced the program for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree Hotel in San Jose, California.
The technical sessions on Tuesday and Wednesday are organized into three tracks: Wafer-Level Packaging, 3D Packaging, and Advanced Manufacturing and Test. The Wafer-Level Packaging (WLP) track features sessions on materials, processes, design, and new technology like Fan-Out WLP. The 3D Packaging track features sessions on Heterogeneous Integration Enablement, materials and equipment, processing technologies, and Smart System Integration and Applications. The Advanced Manufacturing and Test track features sessions on test, productivity, inspection, and metrology.
Subramanian Iyer, Ph.D., Distinguished Chancellor's Professor, Electrical Engineering Department, University of California, Los Angeles is scheduled to give the keynote presentation on the first day of the conference on “Packaging without the Package: A More Holistic Moore's Law.”
Richard (Kwang Wook) Bae, Vice President, Corporate Strategy & Planning, Samsung Electro-Mechanics, will deliver the keynote presentation in the morning of the second day, entitled "Samsung's FOPLP: Beyond Moore.”
Han Byung Joon, Ph.D., Chief Executive Officer, STATS ChipPAC is scheduled to give the keynote presentation in the evening on the second day of the conference on “Innovative Packaging Technologies Usher in a New Era for Integration Solutions.”
Packaging technology experts John Lau, Ph.D., ASM Pacific Technology; John Hunt, ASE (US) Inc.; Fernando Roa, Ph.D., Amkor Technology; and Rao Tummala, Ph.D., Georgia Institute of Technology, are scheduled to lead half-day workshops on Thursday, October 26, 2017.
Registration for IWLPC is now available online. Visit www.iwlpc.com for more information.
Suggested Items
Micross, Sital Announce Global Manufacturing & Distribution Partnership
05/07/2024 | Micross Components, Inc.Micross Components, Inc., a leading global provider of mission-critical microelectronic components and services for high-reliability aerospace, defense, space and industrial applications, is pleased to announce our exclusive partnership with Sital Technology (sitaltech.com), the leader in MIL-STD-1553 IP cores, specializing in integrated FPGA solutions.
Real Time with… IPC APEX EXPO 2024: Innovative Lamination Technology
05/07/2024 | Real Time with...IPC APEX EXPOKevin Barrett of Insulectro and Victor Lazaro of Indubond discuss their companies' partnership, focusing on Indubond's innovative lamination technology that uses induction heating. They discuss the advantages of this technology over traditional methods, its benefits to customers, and the crucial role of automation in manufacturing.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
IDTechEx Discusses Low-Loss Materials: The Enabler of Future Connected Vehicles?
05/06/2024 | IDTechExFuture connected vehicles will offer future drivers a safer, smoother, and more convenient driving experience. Not only will drivers get access to more navigation and entertainment options, but they will also gain access to safety technologies that will potentially reduce accidents, improve congestion, and reduce emissions globally by allowing vehicle safety systems to communicate with each other and with city traffic infrastructure.
BrainChip, Frontgrade Gaisler to Augment Space-Grade Microprocessors with AI Capabilities
05/06/2024 | BUSINESS WIREBrainChip Holdings Ltd, the world’s first commercial producer of ultra-low power, fully digital, event-based, neuromorphic AI IP, and Frontgrade Gaisler, a leading provider of space-grade system-on-chip solutions, announce their collaboration to explore the integration of BrainChip’s AkidaTM neuromorphic processor into Frontgrade Gaisler’s next generation fault-tolerant, radiation-hardened microprocessors.