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Treasury Report Calls for End of Conflict Minerals Regulations
October 10, 2017 | IPCEstimated reading time: Less than a minute
The Treasury Department has called for scrapping corporate reporting requirements on conflict minerals and other topics. The department, in an October 6 report on growing the economy stated, “federal securities laws are ill-equipped to achieve such policy goals, and the effort to use securities disclosure to advance policy goals distracts from their purpose of providing effective disclosure to investors.”
Getting rid of the disclosure rules would require congressional action. Legislation that includes their repeal passed the House earlier this year, but is unlikely to be acted on by the Senate.
In the absence of action in Congress, the report suggested that the Securities and Exchange Commission tweak its rules to exempt smaller and certain newly public companies from reporting.
IPC continues to highlight the burden of conflict minerals compliance, most recently in meetings with members of the House and Senate during the IPC IMPACT advocacy event in Washington, D.C. in May.
Suggested Items
ASMPT to Exhibit Smart Manufacturing at IPC APEX EXPO 2024
03/27/2024 | ASMPTWith its innovative, data-driven Intelligent Factory concept and a comprehensive hardware and software portfolio around SMT production, market and innovation leader ASMPT will be a major presence at the IPC APEX EXPO 2024, the industry’s main event in California.
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
TRI Launches New Advanced Packaging 3D CT AXI Solution
03/26/2024 | TRITest Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.
Blackfox Ready for IPC APEX EXPO 2024
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iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
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