Winton Symposium Tackles the Challenge of Energy Storage and Distribution
October 11, 2017 | University of CambridgeEstimated reading time: 1 minute
The sixth annual Winton Symposium will be held on 9 November at the University’s Cavendish Laboratory on the theme of Energy Storage and Distribution.
Storage and distribution of energy is seen as the missing link between intermittent renewable energy and reliability of supply, but current technologies have considerable room for improvements in performance. Speakers at the annual symposium, which is free and open to the public, will discuss some of the new technologies in this important area, and how understanding the basic science of these can accelerate their development.
“As intermittent forms of renewable energies continue to contribute to a larger share of our energy mix, there is an urgent need to store and efficiently distribute energy to ensure the lights stay on,” said Dr Nalin Patel, Winton Programme Manager at the University of Cambridge.
The one-day event is an opportunity for students, researchers and industrialists from a variety of backgrounds to hear a series of talks given by world-leading experts and to join in the debate. Speakers at the event will include Professor Harold Wilson, Programme Director of the UK Atomic Energy Authority; Professor Katsuhiko Hirose, Professional Partner at Toyota Motor Corporation; and Professor David Larbalestier, Director of the Applied Superconductivity Center, National High Magnetic Field Laboratory at Florida State University. The full programme of speakers is available online.
The symposium is organised by Professor Sir Richard Friend, Cavendish Professor of Physics and Director of the Winton Programme for the Physics of Sustainability and Dr Nalin Patel the Winton Programme Manager.
There is no registration fee for the symposium and complimentary lunch and drinks reception will be provided, however participants are required to register online. The event is open for all to attend.
Suggested Items
IDTechEx Report Unveils 3D Electronics Status and Opportunities
04/22/2024 | PRNewswire3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry.
Microsoft, Google Join as Sponsors for First-Ever AI Expo for National Competitiveness
04/19/2024 | SCSPThe Special Competitive Studies Project (SCSP), a non-partisan, non-profit project dedicated to strengthening America’s long-term competitiveness in artificial intelligence (AI), announced today two additional sponsors of the AI Expo for National Competitiveness.
Scape Technologies Introduces SCAPE CoCreator at Hannover Messe 2024
04/18/2024 | Scape TechnologiesToday's industrial robotics, 3D Vision, and AI are often confined by costs, complexity, and limited accessibility and usability. Scape Technologies is revolutionizing this field by broadening the horizons of what is possible.
Micron’s Full Suite of Automotive-Grade Solutions Qualified for Qualcomm Automotive Platforms to Power AI in Vehicles
04/17/2024 | MicronMicron Technology, Inc. announced that it has qualified a full suite of its automotive-grade memory and storage solutions for Qualcomm Technologies Inc.’s Snapdragon® Digital Chassis™, a comprehensive set of cloud-connected platforms designed to power data-rich, intelligent automotive services.
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and ProspectsIn this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.