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Flexible copper-clad laminate (FCCL) maker Taiflex Scientific Co. Ltd has posted consolidated revenues of NT$1.156 billion ($38.1 million) for September 2017, up by 3.47% month-on-month, and an increase of 38.5% year-on-year. Total revenues for the third quarter was NT$3.22 billion ($106.14 million), up by 16% from the previous quarter, and an increase of 32% compared to 3Q2016.
September revenue for the Electronics Materials (EM) segment reached NT$847 million ($27.9 million), up by 1.66% from the previous month. For the third quarter, revenues of the EM business reached NT$2.37 billion ($78.12 million), up by 45.8% from the previous quarter, and by 23.89% compared with the same period last year, amid increasing market demand.
Happy Holden, I-Connect007
I-Connec007’s Happy Holden had the pleasure of attending IPC’s High Reliability Forum (HRF) in Baltimore in May. As the IPC scripted it, it was a “Technical Conference with a Focus on Electronics Subjected to Harsh-Use Environments.”
Barry Matties, I-Connect007
At the EIPC summer conference, I-Connect007 Publisher Barry Matties caught up with Ventec Europe & Americas COO Mark Goodwin, who provided an update on Ventec’s new products, the current state of the company, and how Ventec is shaking things up in the materials marketplace.
Richard Heimsch, SUPER DRY
Research by SMT & Hybrid GmbH (now SMT Elektronik) was conducted just prior to the original publication of IPC-1601, which now provides detailed guidelines for the packaging and storage of PCBs, both from the PCB manufacturer and at the assembler’s manufacturing floor.