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IPC—Association Connecting Electronics Industries has extended the deadline for submission of poster abstracts for the IPC APEX EXPO 2018 to December 1, 2017.
Poster presentations at IPC APEX EXPO, the industry's premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, are scheduled for February 28, 2018, and will be displayed throughout the event, which will be held in San Diego, California.
Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, in particular, automation in electronics manufacturing; assembly and rework processes; cleaning; flexible circuitry; PCB fabrication; reshoring; robotics; soldering; surface finishes; tin whiskers; wearables; and more.
For more information, click here.
Samuel LeBlanc, Paul Deffenbaugh, Jacob Denkins, and Kenneth Church nSCRYPT INC.
Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is one of the enabling factors for roll-to-roll processes.
Pete Starkey, I-Connect007
This year’s event had a well-chosen and varied programme featuring presentations on process chemistry and R&D consortia, a discussion of controversial standards proposals and a review of the experiences of commissioning new technology in a start-up factory.
Gene Weiner, Weiner International Inc.
IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.