Reading time ( words)
- Institute of Circuit Technology Hayling Island Seminar 2017
- Am Labels presented with distribution award by anytron at LABELEXPO 2017
- NPL/SMART Process, Design & Reliability Seminar
- 3D Printing Shortens PCB Prototyping Cycle
News from productronica
- EIPC @ productronica 2017
- Viscom at productronica with outstanding solutions for 3D AOI and 3D AXI
11/06/2017 | Kiersten Rohde and Jonathan Zinski, I-Connect007
Recently, Anaya Vardya, CEO of American Standard Circuits, invited two of I-Connect007’s newest team members, IT coordinator Jonathan Zinski and Editor Kiersten Rohde, to tour his facility in West Chicago, Illinois. Happy Holden, resident PCB expert, also joined the newbies on their field trip to ASC. In the following articles, Jonathan and Kiersten describe their experience touring ASC. Special thanks to Anaya for hosting the I-Connect007 team.
09/21/2017 | Pete Starkey, I-Connect007
If there’s one benefit of old age, it’s being able to remember the introduction to our industry of technologies that may be taken for granted by the present generation, but were revolutionary at the time. I can recall the history of Ucamco as far back as the late 1980s when, as one of the very early adopters of the DISC laser plotter and its associated electronic PCB front-end tooling system, our company gained entry to a spectacular new world of pre-production engineering capability.
05/12/2017 | Tulip Gu, I-Connect007
The topic of the third issue of PCB007 China Magazine is "The Wide World of Flex." Around this theme, we asked one of the leaders of China's FPC industry, Ding Cheng, general manager of the FPC Division of Shenzhen BYD Electronic Parts Company, to share his perspective about trends in flex, and where he thinks that market is headed in the future.