High-Speed Motion Core Technology for Magnetic Memory
November 1, 2017 | KAISTEstimated reading time: 1 minute
A joint research team led by Professor Kab-Jin Kim of the Department of Physics, KAIST and Professor Kyung-Jin Lee at Korea University developed technology to dramatically enhance the speed of next generation domain wall-based magnetic memory.
Currently-used memory materials, D-RAM and S-RAM, are fast but volatile, leading to memory loss when the power is switched off. Flash memory is non-volatile but slow, while hard disk drives (HDD) have greater storage but are high in energy usage and weak in physical shock tolerance.
To overcome the limitations of existing memory materials, ‘domain wall-based, magnetic memory’ is being researched. The core mechanism of domain wall magnetic memory is the movement of a domain wall by the current. Non-volatility is secured by using magnetic nanowires and the lack of mechanical rotation reduced power usage. This is a new form of high density, low power next-generation memory.
However, previous studies showed the speed limit of domain wall memory to be hundreds m/s at maximum due to the ‘Walker breakdown phenomenon’, which refers to velocity breakdown from the angular precession of a domain wall. Therefore, there was a need to develop core technology to remove the Walker breakdown phenomenon and increase the speed for the commercialization of domain wall memory.
Most domain wall memory studies used ferromagnetic bodies, which cannot overcome the Walker breakdown phenomenon. The team discovered that the use of ‘ferrimagnetic‘ GdFeCo at certain conditions could overcome the Walker breakdown phenomenon and using this mechanism they could increase domain wall speed to over 2Km/s at room temperature.
Domain wall memory is high-density, low-power, and non-volatile memory. The memory could be the leading next-generation memory with the addition of the high speed property discovered in this research.
Professor Kim said, “This research is significant in discovering a new physical phenomenon at the point at which the angular momentum of a ferrimagnetic body is 0 and it is expected to advance the implementation of next-generation memory in the future.”
Suggested Items
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Real Time with... IPC APEX EXPO 2024: Advancements in Laser Depaneling with LPKF
04/24/2024 | Real Time with...IPC APEX EXPOJake Benz, LPKF sales manager for North America, discusses the company's advancements in laser depaneling. LPKF has introduced a green wavelength laser for processing rigid FR-4 circuit boards, bringing significant gains in processing speeds to market. The company transitioned from IR CO2 to UV wavelength due to heat and burning issues.
Real Time with... IPC APEX EXPO 2024: Exploring IPC's PCB Design Courses with Kris Moyer
04/18/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and IPC instructor Kris Moyer discuss IPC's PCB design training and education offerings. They delve into course topics such as design fundamentals, mil/aero, rigid-flex, RF design, and advanced design concepts. They also highlight material selection for high-speed design, thermal management, and dissipation techniques. The interview wraps up with details about how to access these courses online.
Atg Luther Maelzer to Showcase Latest Generation Automatic Flying Probe Test System at IPC APEX EXPO 2024
04/01/2024 | atg Luther & Maelzeratg Luther Maelzer (a Mycronic company) will showcase their latest technology, the A9 with Automation (A9aL), at the upcoming IPC APEX EXPO. The A9AL will be on display from April 9th through the 11th on the show floor at the Anaheim Convention Center in Booth 4829.
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.