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The November issue of The PCB Magazine has published and is now available.
HDI: Today, Tomorrow and the Future
This month, we cover the wide-ranging topic of HDI: from the latest technology developments and manufacturing challenges, to HDI strategies that include design, fabrication, and assembly perspectives. As one of our feature contributors, Happy Holden, says, in North America, there is a growing need for more HDI capability. Find out why in this issue!
Check it all out this month in The PCB Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
You can also download pdf version to your devices for future reference.
Real Time with...CPCA
At the recent CPCA Show 2018 in Shanghai, Jochen Zeller, vice president of AWP Group, speaks about the challenges impacting the wet processing part of the PCB manufacturing industry, such as the continuing miniaturization trend leading to finer widths and line spacings, as well as traceability.
Jan Pedersen, ELMATICA
IPC’s Automotive Addendum task group was started in November 2014 and the first edition of IPC 6012-DA was released in April 2016. We are now working on the revised version, and expect a release in Q2 2018. As standards need to evolve, develop and follow the needs of the industry, this work is continuous.
Patty Goldman, I-Connect007
While at IPC APEX EXPO a few weeks ago, I sat down with George Hsin, chief strategy officer for TUC Worldwide, and Alan Cochrane, president of TUC North America. I was interested in learning more about the company and their laminate products and Alan was happy to fill me in.