AT&S Successfully Issues 175 Million Hybrid Bond


Reading time ( words)

AT&S Austria Technologie & Systemtechnik Aktiengesellschaft has completed the issue of a subordinated bond with an indefinite term and an early redemption option after five years (hybrid bond) very successfully. The issue, which was exclusively directed at institutional investors with a minimum subscription of EUR 100,000, was primarily placed with international investors with the issue amount totalling EUR 175 million. The targeted transaction volume thus significantly exceeded the first time a hybrid bond was issued by AT&S. The coupon was determined at 4.75% due to the great interest. After admission to trading, the hybrid bond will be traded on the Semi-official Market of the Vienna Stock Exchange.

“With the proceeds from this issue, we can strengthen our equity base and at the same time support the further strategic investment programme as a basis for long-term profitable growth,” said CEO Andreas Gerstenmayer. “We are pleased that we have also been able to broaden our investor base after the very positive investor road show due to the strong demand. This demonstrates the confidence in our development so far and our plans for the future.”

Share


Suggested Items

Calumet Electronics on IMPACT 2018

08/14/2018 | Patty Goldman, I-Connect007
This year at IMPACT Washington, DC, I-Connect007's Patty Goldman sat down with Steve Vairo and Mike Kadlec of Calumet Electronics, to get their overview on the event.

Agfa: Staying Ahead of the Technology Curve

08/01/2018 | Barry Matties, I-Connect007
In the ultracompetitive electronics manufacturing space, companies that don’t continually evolve and invest in new technologies run the risk of being left behind. At the recent EIPC summer conference, many next-generation processes and technologies were discussed and even put on display.

MIVA Technologies’ Explosive Growth Shows no Signs of Slowing Down

07/19/2018 | Patty Goldman, I-Connect007
MIVA Technologies is a leading equipment builder for direct imaging technologies in the circuit board and microelectronics space. The company’s head of its business development group, Brendan Hogan, sat down for an interview to provide some background and where the company’s specialties lie.



Copyright © 2018 I-Connect007. All rights reserved.