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AT&S Austria Technologie & Systemtechnik Aktiengesellschaft has completed the issue of a subordinated bond with an indefinite term and an early redemption option after five years (hybrid bond) very successfully. The issue, which was exclusively directed at institutional investors with a minimum subscription of EUR 100,000, was primarily placed with international investors with the issue amount totalling EUR 175 million. The targeted transaction volume thus significantly exceeded the first time a hybrid bond was issued by AT&S. The coupon was determined at 4.75% due to the great interest. After admission to trading, the hybrid bond will be traded on the Semi-official Market of the Vienna Stock Exchange.
“With the proceeds from this issue, we can strengthen our equity base and at the same time support the further strategic investment programme as a basis for long-term profitable growth,” said CEO Andreas Gerstenmayer. “We are pleased that we have also been able to broaden our investor base after the very positive investor road show due to the strong demand. This demonstrates the confidence in our development so far and our plans for the future.”
Karl Dietz, Karl Dietz Consulting LLC
From a PCB fabricator’s perspective, epoxy resin supply chain issues are of indirect concern as they become a subset of laminate quality, supply, and cost considerations.
François Lechleiter, CIMULEC GROUP and Yves Jannot, UNIVERSITÉ DE LORRAINE, LEMTA CNRS
Most of today’s printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axes, especially when a good accuracy is expected. Few base material suppliers’ datasheets show X, Y and Z thermal conductivities. In most cases, a single value is given, moreover determined with a generic methodology, and not necessarily adapted to the reality of glass-reinforced composites with a strong anisotropy.
Barry Matties and Stephen Las Marias, I-Connect007
Passive intermodulation (PIM) is a circuit anomaly that has been occurring in cellular base station antennas, causing tremendous frustration and cost to antenna OEMs. As the supplier of the materials being used by these OEMs, Rogers Corp., and more specifically, Product Manager Tony Mattingly, must come up with a solution.