Reading time ( words)
The Institute of Circuit Technology (ICT) Evening Seminar, which will be held December 5, 2018 at the Majestic Hotel in Harrogate, UK, will feature Emma Hudson of UL, Andy Cobley of Coventry University, and Jean-Paul Birraux of First EIE (Geneva) as presenters.
Hudson will present on the topic of solder limits for recognized PCBs and materials. Cobley, meanwhile, will present on a new project, Selective Metallization of Dielectric Substrates Using a Magnetic Field.
Birraux, on the other hand, will give a presentation titled “Developments in Photo-plotters, UV Direct Imaging and Automatic Visual Inspection (AVI) Systems”.
For more information, click here.
Patty Goldman, I-Connect007
While walking around the PCB hall at productronica, I was approached by my good friend Gene Weiner. Gene emphatically directed me to the Elga booth to find out about their new extra-thick dry film that can image extremely fine features with a perfectly perpendicular sidewall. Elga Europe CEO Giorgio Favini filled me in on the details.
Barry Matties, I-Connect007
With the recent planned acquisition of Orbotech in place by maker KLA-Tencor, much of the industry has speculated about Orbotech’s future. Barry Matties spoke with CEO Asher Levy about what lies in store for the Orbotech group and, more specifically, their PCB division should the deal close.
Jan Pedersen, ELMATICA
IPC’s Automotive Addendum task group was started in November 2014 and the first edition of IPC 6012-DA was released in April 2016. We are now working on the revised version, and expect a release in Q2 2018. As standards need to evolve, develop and follow the needs of the industry, this work is continuous.