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The 2017 International Printed Circuit & APEX South China Fair (2017 HKPCA & IPC Show), to be held from December 6–8, 2017 at the Shenzhen Convention & Exhibition Center in Shenzhen, China, will feature leading industry experts sharing their insights on the latest market trends and innovations.
Topics to be discussed include advancing HDI technology, mobile intelligent telecommunications, PCB production for the automotive industry, smart manufacturing for PCB production, cleaning PCB / PCBA flux residual process, and conformal coating trends, among others.
Click here to view the full agenda.
07/26/2018 | Dan Feinberg, Technology Editor, I-Connect007
I-Connect007 Technical Editor Dan Feinberg accepted an invitation recently to tour Nano Dimension’s new USA headquarters in Santa Clara’s Silicon Valley, which included a sit-down with President and Co-Founder Simon Fried.
06/22/2018 | Patty Goldman, I-Connect007
If you’re like me, you’ve probably heard of 5G, but you may not understand what all the fuss is about. First, 5G simply means fifth-generation mobile networks. The best way to understand what 5G is about is to understand all the other Gs, like 3G and 4G (we rarely hear about the early Gs!).
04/11/2018 | Stephen Las Marias, I-Connect007
At the recent HKPCA and IPC Show 2017 in Shenzhen, China, I was able to interview Les Sainsbury, CEO, and Andrew Kelley, CTO, of XACT PCB, as well as Alex Stepinski, vice president of Whelen Engineering’s PCB Fab Business Unit, to discuss process evolution and technology developments in the PCB manufacturing industry.