SEMI European 3D Summit Makes Dresden Debut


Reading time ( words)

The SEMI European 3D Summit will make its Dresden, Germany, debut 22-24 January 2018, featuring a broader scope of 3D topics driving innovation and business opportunities in the 3D market. The event will highlight the latest 3D technologies including 3DIC Through-Silicon-Via (TSV), 2.5D, 3D FO-WLP/ e-WLB, glass interposers, thermal management and 3D alternative technologies for heterogeneous integration and high-density systems.

A market briefing on the latest business challenges and opportunities in the 3D sector will kick off the summit, with 3D and packaging industry experts presenting their exclusive business and market insights and analysis confirming the huge forecast growth of advanced packaging. Keynotes and presentations on the current adoption of 3D applications such as high-end memory, performance, mobile, imaging and automotive will highlight this 6th edition of SEMI European 3D Summit.

Sold-out for five years straight, the European 3D Summit will showcase the leading names in 3D integration microelectronics manufacturing and offer numerous networking opportunities including a gala dinner and cocktail hour, along with frequent coffee and lunch break mixers. In addition, attendees will meet emerging new talent engaged in the future of 3D integration including Sabrina Fadloun, PhD student and senior field process engineer, SPTS Technologies, and September 2017 winner of the international competition “My Thesis in 180 Seconds.”

The European 3D Summit will showcase speakers from companies such as Third Millennium Test Solutions (3MTS), Amkor Technology, CEA-Leti, Chipworks, Epcos, Fraunhofer, GLOBALFOUNDRIES, Hewlett Packard, Huawei, IBM, IMEC, Intel, ProPrincipia, Qualcomm, Silex, ST Microelectronics, SMIC, TechSearch, Tessera Xperi, Université de Sherbrooke, Western Digital, X-Fab and Yole Développement.

Featuring a huge supplier base, Dresden is home to some of Europe’s largest fabs, from GLOBALFOUNDRIES, Infineon, and X-FAB to a new 300mm BOSCH fab.

Premium Sponsors of the European 3D Summit are SPTS Technologies (platinum sponsor), ASE Group (gold sponsor), Suss MicroTec Group (silver sponsor), EV Group and Trymax (event sponsor)

Registration is open. Register before December 16 for a discount.

Please find more registration information click here.

About SEMI

SEMI connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.  For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

Share


Suggested Items

Bangladesh Smartphone Market Continues Double-Digit Growth in 2017

03/13/2018 | IDC
One out of the three smartphones shipped in Bangladesh was a 4G-enabled smartphone in 2017. Global and China-based vendors have already upgraded most of their devices to 4G.

What’s Coming in 3D Printing Technology in 2018

12/27/2017 | Cullen Hilkene, 3Diligent
First, the arrival of extrusion metal printing. Today's extrusion printers are the most prevalent and, arguably, user-friendly 3D Printers in the market. Now, after years of there being zero metal extrusion printers, there will be two in the new year from Desktop Metal and Markforged. These technologies promise new materials and a higher degree of user friendliness for metal printing.

Global LED Market Expected to Record a CAGR of close to 17% until 2020

05/26/2016 | Business Wire
This research report titled ‘Global LED Market 2016-2020’ provides an in-depth analysis of market growth in terms of revenue and emerging market trends. The market size is calculated on the basis of revenue generated from four segments, including general lighting, backlighting, automotive lighting, and others.



Copyright © 2018 I-Connect007. All rights reserved.