SEMI European 3D Summit Makes Dresden Debut
December 13, 2017 | SEMIEstimated reading time: 2 minutes
The SEMI European 3D Summit will make its Dresden, Germany, debut 22-24 January 2018, featuring a broader scope of 3D topics driving innovation and business opportunities in the 3D market. The event will highlight the latest 3D technologies including 3DIC Through-Silicon-Via (TSV), 2.5D, 3D FO-WLP/ e-WLB, glass interposers, thermal management and 3D alternative technologies for heterogeneous integration and high-density systems.
A market briefing on the latest business challenges and opportunities in the 3D sector will kick off the summit, with 3D and packaging industry experts presenting their exclusive business and market insights and analysis confirming the huge forecast growth of advanced packaging. Keynotes and presentations on the current adoption of 3D applications such as high-end memory, performance, mobile, imaging and automotive will highlight this 6th edition of SEMI European 3D Summit.
Sold-out for five years straight, the European 3D Summit will showcase the leading names in 3D integration microelectronics manufacturing and offer numerous networking opportunities including a gala dinner and cocktail hour, along with frequent coffee and lunch break mixers. In addition, attendees will meet emerging new talent engaged in the future of 3D integration including Sabrina Fadloun, PhD student and senior field process engineer, SPTS Technologies, and September 2017 winner of the international competition “My Thesis in 180 Seconds.”
The European 3D Summit will showcase speakers from companies such as Third Millennium Test Solutions (3MTS), Amkor Technology, CEA-Leti, Chipworks, Epcos, Fraunhofer, GLOBALFOUNDRIES, Hewlett Packard, Huawei, IBM, IMEC, Intel, ProPrincipia, Qualcomm, Silex, ST Microelectronics, SMIC, TechSearch, Tessera Xperi, Université de Sherbrooke, Western Digital, X-Fab and Yole Développement.
Featuring a huge supplier base, Dresden is home to some of Europe’s largest fabs, from GLOBALFOUNDRIES, Infineon, and X-FAB to a new 300mm BOSCH fab.
Premium Sponsors of the European 3D Summit are SPTS Technologies (platinum sponsor), ASE Group (gold sponsor), Suss MicroTec Group (silver sponsor), EV Group and Trymax (event sponsor)
Registration is open. Register before December 16 for a discount.
Please find more registration information click here.
About SEMI
SEMI connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.