Park Electrochemical Declares Cash Dividend

Reading time ( words)

The Board of Directors of Park Electrochemical Corp. declared a regular quarterly dividend of $0.10 per share payable February 6, 2018 to shareholders of record at the close of business on January 2, 2018.

Park has paid 32 consecutive years of uninterrupted regular, quarterly cash dividends, without ever skipping a dividend payment or reducing the amount of the dividend, and has paid approximately $349 million in dividends, or $17.00 per share, since the beginning of its 2005 fiscal year.

About Park Electrochemical Corp.

Park Electrochemical Corp. is a global advanced materials company which develops and manufactures advanced composite materials, primary and secondary structures and assemblies and low-volume tooling for the aerospace markets and high-technology digital and RF/microwave printed circuit materials principally for the telecommunications and internet infrastructure, enterprise and military markets. The Company’s manufacturing facilities are located in Kansas, Singapore, France, Arizona and California. The Company also maintains R & D facilities in Arizona, Kansas and Singapore.


Suggested Items

Institute of Circuit Technology Meriden Seminar, 2018

03/21/2018 | Pete Starkey, I-Connect007
The Institute of Circuit Technology returned to Meriden, traditionally regarded as the centre of England, for its Annual General Meeting, which was followed by a technical seminar of five presentations, introduced as ever by Technical Director Bill Wilkie.

The Sum of All Parts: Defining Your Customer

03/09/2018 | Sam Sangani, PNC Inc.
These are the most typical ways in which someone will ask us who our customers are. Many times, the purpose is to see whether we work in the same spaces as them or as a way of gauging whether we are “worthy” enough of having them as a customer.

A Plug-in that Connects CAD Software to 3D Printer

03/13/2018 | Dan Feinberg
Nano Dimension's DragonFly 2020 Pro 3D Printer is a highly accurate and versatile inkjet deposition and curing system for printing professional multilayer circuit boards, structural electronics and antennas. In a sweeping discussion with Nano Dimension USA President Simon Fried, all my questions were answered about this innovative technology.

Copyright © 2018 I-Connect007. All rights reserved.