EIPC SpeedNews: News from the European PCB Industry


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News from the EIPC

- Review: EIPC Winter Conference Lyon

- Proceedings Conference Lyon Free of Charge by EIPC members

- New Date and Location of EIPC 50th Anniversary Conference: June 21–22, 2018, Geldern, Germany

News from Germany

- Smart Systems Integration 2018: Program Highlights for Visitors

Semiconductor Industry News

- Cryptocurrency Craze Boosts Demand for Memory Chips

News from Switzerland

- DYCONEX Opts for Automated Guided Vehicles

News from the UK

- SCS Partners with DTI to Sponsor UK Electronics Industry at International Events

- 2018 ICT Annual Symposium, June 5, 2018, National Motor Museum

- 2018 Spring Seminar and AGM, Best Western Plus Manor Hotel, March 13, 2018

- Annual Foundation Course April 9–12; First day at Merlin PCB, Deeside, and then at Chester University

News from the USA

- Ventec to Showcase Thermal Management Solutions and Latest Laminate Technology at IPC APEX EXPO 2018

- Atotech to Present and Exhibit at the IPC APEX Expo 2018

News from WECC Members  

Click here for the International Events Diary 2018

Click here to download the complete SpeedNews Issue 4

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Suggested Items

Technology Ambassador Alun Morgan

12/10/2018 | Barry Matties, I-Connect007
Barry Matties speaks with Alun Morgan about his new position as technology ambassador for Ventec International Group. In this position, Alun will use his wealth of knowledge and experience to inform the supply chain better when it comes to topics like thermal management and the sometimes shaky connection between designers and material suppliers.

Ventec's Marketing Strategy and Their Newly Appointed Technology Ambassador

12/05/2018 | Pete Starkey, I-Connect007
At electronica 2018, Mark Goodwin, chief operating officer at Ventec International Group, discusses the company’s marketing strategy along with their newly appointed technology ambassador, Alun Morgan, and how he sees the world.

Ventec Keeps 'Shaking Things Up' with tec-speed 20.0

09/10/2018 | Barry Matties, I-Connect007
At the EIPC summer conference, I-Connect007 Publisher Barry Matties caught up with Ventec Europe & Americas COO Mark Goodwin, who provided an update on Ventec’s new products, the current state of the company, and how Ventec is shaking things up in the materials marketplace.



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