Reading time ( words)
RBP Chemical Technology will be holding a webcast on troubleshooting printed wiring board defects on Tuesday, February 20, 2018, at 11:00 am (CST).
Led by Mike Carano, RBP Vice President Technology and Business Development, this webcast series explores the most intricate factors of advanced problem solving of printed circuit board defects and how the interrelationship of both up and downstream processes contribute to scrap product.
Topics to be discussed include: panel versus pattern plating, imaging and developing defects, electroplating of copper, and proper process maintenance.
Barry Matties, I-Connect007
Barry Matties met with Sharon Cohen, president of Orbotech West, at productronica 2017 to discuss what’s new at Orbotech, specifically their shift to be more customer-centric and to provide regional coverage across the globe. He also discusses the current trends in the marketplace and Industry 4.0.
Pete Starkey, I-Connect007
Venue for the 2018 EIPC Winter Conference was the splendid new Alstom Transport Information Solutions facility in Villeurbanne, in the Lyon metropolitan area of the Auvergne-Rhône-Alpes region in eastern France. An extremely popular event—117 delegates represented a total of 20 countries, unprecedented in recent years, and only just fitted into Alstom’s conference suite. Indeed, some were even standing at the back!
Patty Goldman, I-Connect007
Circuit Automation’s Tom Meeker joined me for a conversation at productronica 2017 in Munich, to update me about what the company has been doing in solder mask coating equipment.