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Bowman announces the appointment of Timothy He as Principal XRF Scientist.
In making the appointment, Bowman Chief Technology Officer Jun Choi, says, “Tim He will report directly to me, and will have two primary responsibilities. He will be responsible for the expansion of applications for Bowman XRF coating measurement technology, with a focus on EPIG, ENEPIG, and other PCB applications; he will also lead Bowman’s development team for materials integrity testing.”
Mr. He was previously Principal Scientist with Tribogenics, Inc., a manufacturer of triboluminescence-based X-ray products based in Los Angeles. Previous to that, he was senior detectors scientist at Bruker Corporation.
“With his broad, but highly relevant background,” adds Choi, “Tim He is an extraordinary addition to our technical team.” For more information, click here.
Sven Kramer, Lackwerke Peters
This article focuses on three different coating material groups that were formulated to operate under high thermal stress and are applied at the printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications.
I-Connect007’s Patty Goldman, Barry Matties, Andy Shaughnessy, and Happy Holden were recently joined by MacDermid Enthone team members Jordan Kologe, technical marketing specialist; Ted Antonellis, applications manager for electronics specialties; and Don Cullen, marketing director for electronics solutions and MacDermid performance solutions. The discussion topic was the wet processing end of PCB manufacturing.
Patty Goldman, I-Connect007
While at IPC APEX EXPO a few weeks ago, I sat down with George Hsin, chief strategy officer for TUC Worldwide, and Alan Cochrane, president of TUC North America. I was interested in learning more about the company and their laminate products and Alan was happy to fill me in.