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Released in November, The Printed Circuit Designer’s Guide to… Power Integrity by Example micro eBook has been downloaded by hundreds of engineers and other readers interested in PCB design.
This book is part of I-Connect007’s ongoing series, The Printed Circuit Designer’s Guide to…, which is specifically dedicated to educating PCB designers, and serves as a valuable resource for people seeking the most relevant design information available. Written by Fadi Deek of Mentor, A Siemens Business, Power Integrity by Example complements Deek’s first design title, Signal Integrity by Example.
The power integrity book provides a thorough investigation of power distribution network performance. Deek addresses problematic issues within electronic transmissions, and presents a variety of simulations and analyses in every chapter. Readers will gain a better understanding of cause-effect relationships between varying factors and how to consider these when making design decisions.
Gene Garat, president of MossEDA, describes the book as having, “Just the right amount of technical content. It covers the basics of power integrity analysis in fewer than 40 pages. Engineers new to the field, as well as career veterans, can all benefit from this quick, well-illustrated read with plenty of examples.”
Download your free copy today! You can also view other titles in our full library.
Look for these other exciting titles in The Printed Circuit Designer’s Guide to… series:
- Thermal Management with Insulated Metal Substrates by Ventec International Group
- Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals by American Standard Circuits
- Secrets of High-Speed PCBs — Parts 1 & 2 by Polar Instruments
- Design for Manufacturing (DFM) by Altium
We hope you enjoy The Printed Circuit Designer’s Guide to… Power Integrity by Example.
For more information, contact:
Bill Acito, Cadence Design Systems
The challenges faced by the PCB designers of today are significant. If we examine the breadth of designs, we find ever-increasing data rates and more high-speed signal routing that drive additional challenges meeting signal-quality requirements, including reflection signal loss and crosstalk issues. At the same time, designers are being asked to complete designs in shorter cycle times and in smaller form factors. They must come up with new and more complex routing strategies to better control impedance and crosstalk. Manual implementation is often time-consuming and prone to layout errors.
Dave Wiens, Mentor, a Siemens Business
PCB designers working with flex or rigid-flex technology face many potential risks that can derail a project and cause costly design failures. As the name implies, flex and rigid-flex designs comprise a combination of rigid and flexible board technologies made up of multiple layers of flexible circuit substrates, attached internally and/or externally to one or more rigid boards. These combinations provide flexibility for the PCB designer working on dense designs that require a specific form factor. Rigid-flex allows the PCB design team to cost-efficiently apply greater functionality to a smaller volume of space, while providing the mechanical stability required by most applications.
Andy Shaughnessy, Design007 Magazine
Millennials are the future of our industry. What does this mean for the PCB design community? How do we attract more of these smart young people to the world of PCB design? I asked Paul Musto, director of marketing for Mentor’s Board Systems Division, to explain the company’s initiatives aimed at drawing more young people into PCB design