Reading time ( words)
As the IPC APEX EXPO events approach, iNEMI’s preparations for the Product Emulator Group (PEG) Workshop and Technology Working Group (TWG) Kick-Off on February 25 and 26 are finalizing. Attendees will hear updates from all the PEGs with respect to the latest industry analyses from Prismark, and then the TWG teams will formalize and share their plans to revise their reports.
iNEMI is also evangelizing for the roadmap effort during APEX EXPO week, spreading the word of this historical electronics roadmap and the value it brings to iNEMI members, roadmap participants and, of course, the electronics industry.
For more information and how to register for the PEG Workshop/TWG Kick-Off at IPC APEX EXPO, click here.
Patty Goldman, I-Connect007
This year at IMPACT Washington, DC, I-Connect007's Patty Goldman sat down with Steve Vairo and Mike Kadlec of Calumet Electronics, to get their overview on the event.
I-Connect007’s Patty Goldman, Barry Matties, Andy Shaughnessy, and Happy Holden were recently joined by MacDermid Enthone team members Jordan Kologe, technical marketing specialist; Ted Antonellis, applications manager for electronics specialties; and Don Cullen, marketing director for electronics solutions and MacDermid performance solutions. The discussion topic was the wet processing end of PCB manufacturing.
Pete Starkey, I-Connect007
The sun was shining in Dusseldorf as delegates returned to the conference room for the second day of the EIPC 50th Anniversary Conference. There were very few empty chairs—even those who had enjoyed a late networking session in the hotel bar had taken their seats as Paul Waldner opened the proceedings with Session 5, on a theme of future PCB design, material and processes for the PCB supply chain.