Join iNEMI's PEG Workshop/TWG Kick-Off at IPC APEX EXPO 2018


Reading time ( words)

As the IPC APEX EXPO events approach, iNEMI’s preparations for the Product Emulator Group (PEG) Workshop and Technology Working Group (TWG) Kick-Off on February 25 and 26 are finalizing. Attendees will hear updates from all the PEGs with respect to the latest industry analyses from Prismark, and then the TWG teams will formalize and share their plans to revise their reports.

iNEMI is also evangelizing for the roadmap effort during APEX EXPO week, spreading the word of this historical electronics roadmap and the value it brings to iNEMI members, roadmap participants and, of course, the electronics industry.

For more information and how to register for the PEG Workshop/TWG Kick-Off at IPC APEX EXPO, click here.

Share

Print


Suggested Items

Dan Gamota Discusses Flex and Alternative Substrates

03/14/2019 | Patty Goldman and Andy Shaughnessy, I-Connect007
As the VP of manufacturing technology and innovation for Jabil, Dan gave us his take on the current state of flex and alternative substrates and explained why modeling, automation, and process controls are likely to be key ingredients in the recipe for manufacturing non-FR-4 boards in the future.

RTW IPC APEX EXPO 2019: Insulectro Sees Growth and Opportunities in Printed Electronics

03/11/2019 | Real Time with...IPC
Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.

Flex/MSTC Joint Conference: A Collaborative Week in Monterey

03/06/2019 | Nolan Johnson, I-Connect007
Collaboration filled the air at the Hyatt Regency in Monterey, California, as the 18th annual Flex/Mems&Sensors technical conference brought flex technology and sensor experts and 550+ attendees together to network and share ideas from February 18–21, 2019.



Copyright © 2019 I-Connect007. All rights reserved.