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Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
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This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
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EIPC SpeedNews: News from the European PCB Industry
March 8, 2018 | EIPCEstimated reading time: Less than a minute
- Call for Papers for EIPC 50th Anniversary Conference: June 21–22, 2018, Dusseldorf, Germany
- Atotech to Present MultiPlate for Power IC at SEMICON China 2018
- Aegis Software to Host Exclusive Industry 4.0 Seminars on 'Paperless' Technology
- Atotech's MultiPlate for FOPLP, The Topic Everyone is Talking About at IMAPS Device Packaging Conference
- Polar Welcomes Dorine Gurney as President of Polar Instruments Inc.
Suggested Items
Lupita Maurer Appointed President at Polar Instruments, Inc
07/27/2023 | Polar InstrumentsCoinciding with our move to new offices in central Beaverton, OR, Polar appoints Lupita Maurer as President of Polar Instruments, Inc.
The Pulse: Rough Roughness Reasoning
07/20/2023 | Martyn Gaudion -- Column: The PulseReliable bonding reduces the risk of delamination through thermal stresses. The tried-and-tested way of achieving a good, reliable bond is to ensure that the copper is sufficiently rough to promote adhesion to the epoxy resin in the prepreg material. As materials and bonding technology improves, the copper surfaces can be made increasingly flatter and still achieve the desired reliability. In the future, new bonding methods—some already here but still on the high-priced side of the equation— may allow extremely flat copper to bond reliably. Meanwhile, as the industry is heading down the road of “smoother” copper, there is still a need to model the effects of a rough surface on signal transmission.
An Exclusive Review of the Institute of Circuit Technology’s Annual Symposium
06/15/2023 | Pete Starkey, I-Connect007After a long crawl through heavy traffic on the M42 motorway, it was a great relief to exit at Junction 6 and arrive at the National Conference Centre for the 2023 Annual Symposium of the Institute of Circuit Technology on June 6. The conference center is co-located with the historic National Motorcycle Museum and situated in the heart of the UK midlands, a stone’s throw from Birmingham International Airport. The delegates were welcomed by technical director Bill Wilkie.
Slash Sheets: Don’t Fall Into the Trap
06/08/2023 | Geoffrey Hazelett, Technical SalesSlash sheets can be confusing, and this is a big topic, so let’s start big and drill down from there. Here’s the big picture regarding slash sheet references: They were designed to provide handy groupings of PCB materials (laminates, polyimides, etc.) that go into a stackup. These groupings are designed around mechanical characteristics to provide insight for PCB fabricators to identify similar laminates with similar properties.
The Pulse: Instilling an Informal Information Culture
03/21/2023 | Martyn Gaudion -- Column: The PulseInformal information exists within most companies and distilling this knowledge into tools is not an easy task—maybe even an impossible one. But what’s most important in maximizing this informal information is to have a good communication network, those “go to” people for a particular purpose. It is important that the company promotes a culture of openness and sharing, or knowledge has a risk of being ring-fenced and locked away.