Tiny Crystals Pave the Way for New Design of Digital Devices
August 29, 2018 | Curtin UniversityEstimated reading time: 1 minute
Curtin researchers have developed a tiny electrical circuit that may enable an entirely new design of digital devices.
The electrical circuit is made from crystals of copper that are grown and electrically wired at nanoscale and may lead to digital devices that have increasing amounts of computational power packed into a smaller space.
In a paper published today in the leading nanotechnology journal ACS Nano, researchers used a single nanoparticle to create an ensemble of different diodes – a basic electronic component of most modern electronic devices, which functions by directing the flow of electric currents.
Lead researcher PhD candidate Yan Vogel, from Curtin’s School of Molecular and Life Sciences and the Curtin Institute for Functional Molecules and Interfaces, said the research team used a single copper nanoparticle to compress in a single physical entity that would normally require many individual diode elements.
Vogel said the research showed that each nanoparticle had an in-built range of electrical signatures and had led to something akin to ‘one particle, many diodes’, thereby opening up the concept of single-particle circuitry.
Vogel said the breakthrough would enable new concepts and methods in the design of miniaturised circuitry.
“Instead of wiring-up a large number of different sorts of diodes, as is done now, we have shown that the same outcome is obtained by many wires landing accurately over a single physical entity, which in our case is a copper nanocrystal,” says Vogel.
Team leader Dr Simone Ciampi, also from Curtin’s School of Molecular and Life Sciences and the Curtin Institute for Functional Molecules and Interfaces, said the new research followed that published by himself and his Curtin colleague Dr Nadim Darwish in 2017, when they created a diode out of a single-molecule, with a size of approximately 1 nanometer, and would help to continue the downsizing trend of electronic devices.
“Last year, we made a breakthrough in terms of the size of the diode and now we are building on that work by developing more tuneable diodes, which can potentially be used to make more powerful and faster-thinking electronic devices,” says Ciampi.
“Current technology is reaching its limit and molecular or nanoparticle diodes and transistors are the only way that we can continue the improvement of computer performances. We are trying to contribute to the development of the inevitable next generation of electronics.”
Suggested Items
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?