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Paul Cooke of Ventec Talks About Glassless Revolution, High Reliability

04/09/2024 | Marcy LaRont, PCB007 Magazine
Marcy LaRont from I-Connect007 caught up with Paul Cooke from Ventec at the SMTA UHDI Symposium on March 26 in Arizona. Paul discusses the challenges in developing future product lines for extremely high density, high reliability manufacturing, and focuses on the transition from glass to glassless substrate technology. He explains the advantages of using pure resin systems, enabling fabricators to create thinner materials for micro vias.

SCHMID Group Presents Breakthrough Solutions for Substrate Production at ISES USA

04/09/2024 | SCHMID Group
The SCHMID Group, a global leader in providing solutions to the high-tech electronics, photovoltaics, glass, and energy systems industries participated in the International Semiconductor Executive Summit (ISES) USA this week.

iNEMI Packaging Tech Topic Webinar: Glass Substrates for Advanced Packaging

02/08/2024 | iNEMI
iNEMI Packaging Tech Topic Webinar on Glass Substrates for Advanced Packaging will be conducted by Dr. Gang Duan & Dr. Dilan Seneviratne, Intel Corporation on February 20, 2024.

RayNeo Announces Collaboration with Qualcomm, Applied Materials on AI-enabled AR Glasses

01/12/2024 | PRNewswire
RayNeo, an industry leader in consumer-grade augmented reality (AR) innovation, today announced it is collaborating with Qualcomm Technologies, Inc. and Applied Materials, Inc. to develop and bring to market a next generation of market-leading AR glasses.

SCHMID Group to Exhibit at productronica

11/07/2023 | SCHMID Group
The SCHMID Group, a global solution provider for the high-tech electronics, photovoltaics, glass and energy systems industries, will be exhibiting at productronica in Munich from November 14 – 17, 2023.
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